DuxPCB Technologies Co., Ltd.
| Payment Terms | MoneyGram,Western Union,T/T,D/P,D/A,L/C |
| Supply Ability | 200,000 units/month |
| Delivery Time | 3–5 days for prototype, 7–10 days for mass production |
| Packaging Details | Anti-static + vacuum + foam + outer carton |
| Name | LED PCB Assembly |
| Brand Name | DUXPCB |
| Model Number | LED PCB Assembly |
| Certification | UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. |
| Place of Origin | China |
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Product Specification
| Payment Terms | MoneyGram,Western Union,T/T,D/P,D/A,L/C | Supply Ability | 200,000 units/month |
| Delivery Time | 3–5 days for prototype, 7–10 days for mass production | Packaging Details | Anti-static + vacuum + foam + outer carton |
| Name | LED PCB Assembly | Brand Name | DUXPCB |
| Model Number | LED PCB Assembly | Certification | UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. |
| Place of Origin | China | ||
| High Light | 32 Layers LED PCB Assembly ，Automotive PCB Assembly Service ，Industrial Lighting PCB Assembly Service | ||
LED PCB Assembly | Metal Core & Heavy Copper | Automotive & Industrial Lighting | DuxPCB
LED PCB assembly involves the integration of high-brightness light-emitting diodes onto specialized substrates engineered to manage extreme thermal loads. DuxPCB provides advanced assembly solutions featuring High-Density Interconnect (HDI) structures and Metal Core PCBs (MCPCB) that ensure operational stability in high-current applications. Our process adheres to IPC Class 3 standards, focusing on fine-pitch placement and specialized solder paste formulations that mitigate thermal stress in harsh industrial and automotive environments.
Our engineering team specializes in substrates with high thermal conductivity, ranging from standard aluminum bases to advanced copper-core and ceramic (AlN/Al2O3) solutions. We utilize thin, high-performance dielectrics to minimize thermal resistance, allowing for maximum heat dissipation from the LED junction to the environment. For applications involving smart lighting controllers, we integrate Rogers and High-Tg FR4 materials to maintain signal integrity and prevent delamination under continuous high-temperature cycling.
Consistent optical performance requires meticulous LED binning and component management. DuxPCB ensures that every assembly maintains color temperature (CCT) and luminous flux consistency through strict BOM control and automated optical inspection (AOI). We offer precision placement for components as small as 0201 and fine-pitch ICs, supported by 3D Solder Paste Inspection (SPI) to prevent common defects such as voiding or solder bridging in dense LED arrays.
| Parameter | Technical Specification |
|---|---|
| Base Materials | Aluminum (6061/5052), Copper, FR4, Rogers, Ceramic, Polyimide |
| Thermal Conductivity | 1.0 W/m·K to 400 W/m·K (Copper Base) |
| Layer Count | 1 - 32 Layers |
| Copper Weight | 0.5 oz to 10 oz (Heavy Copper Capability) |
| Dielectric Thickness | 50μm to 150μm (High-Voltage Insulation) |
| Min Trace/Space | 2 mil / 2 mil (Fine Pitch) |
| Surface Finish | ENIG, ENEPIG, OSP, Immersion Silver, HASL-LF |
| Max Board Dimensions | 500mm x 1200mm (Extended Strip Capability) |
| Assembly Standards | IPC-A-610 Class 3, ISO 9001, UL Approved |
To initiate your high-performance LED project, upload your Gerber files and BOM through our secure portal for a comprehensive technical review and quote.
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
10 Million USD-50 Million
Employee Number:
201~500
Ecer Certification：
Verified Supplier
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