DuxPCB Technologies Co., Ltd.
| Payment Terms | MoneyGram,Western Union,T/T,D/P,D/A,L/C |
| Supply Ability | 200,000 units/month |
| Delivery Time | 3–5 days for prototype, 7–10 days for mass production |
| Packaging Details | Anti-static + vacuum + foam + outer carton |
| Name | SMT Stencil PCB Assembly |
| Brand Name | DUXPCB |
| Model Number | SMT Stencil |
| Certification | UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. |
| Place of Origin | China |
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Product Specification
| Payment Terms | MoneyGram,Western Union,T/T,D/P,D/A,L/C | Supply Ability | 200,000 units/month |
| Delivery Time | 3–5 days for prototype, 7–10 days for mass production | Packaging Details | Anti-static + vacuum + foam + outer carton |
| Name | SMT Stencil PCB Assembly | Brand Name | DUXPCB |
| Model Number | SMT Stencil | Certification | UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. |
| Place of Origin | China | ||
| High Light | High Precision SMT Stencil ，Surface Mount Stencil PCB ，SMT Stencil PCB Assembly | ||
At DuxPCB, we understand that high-precision SMT stencils are the foundation of high-yield assembly for high-density interconnect (HDI) and fine-pitch designs. Our stencils are engineered using advanced laser-cut and electroformed technologies to ensure absolute precision in solder paste deposition, which is critical for Class 3 electronics in medical, aerospace, and industrial applications. By optimizing aperture geometry and wall smoothness, we help customers achieve zero-defect manufacturing even for challenging components like 01005 passives and 0.3mm pitch BGAs.
To accommodate PCBs with mixed-component densities, we provide custom Step-Up and Step-Down stencils. This technology allows for varying solder paste volumes on a single board, ensuring large connectors receive sufficient paste while adjacent fine-pitch ICs remain free from bridging. Furthermore, our high-performance Nano-coating provides a permanent hydrophobic surface that significantly improves transfer efficiency and reduces the need for underside wiping, maintaining the signal integrity required for high-speed digital designs.
| Specification | DuxPCB Capability |
|---|---|
| Materials | 304 Full-Hard Stainless Steel, Fine Grain (FG) Steel, Nickel |
| Foil Thickness | 0.03mm - 0.50mm (1.2 mil - 20 mil) |
| Aperture Tolerance | +/- 0.005mm (5μm) |
| Maximum Frame Size | 736mm x 736mm (29" x 29") |
| Fine-Pitch Capability | Down to 0.2mm pitch components |
| Surface Finishes | Electropolishing, S-Nano Coating, Dual-Sided Deburring |
| Step Technology | Laser-welded or Etched Step-Up/Step-Down (min 0.02mm increments) |
Secure your assembly yield today by uploading your Gerber files for a comprehensive technical review. Our engineers are ready to optimize your SMT stencil for industrial-grade reliability and precision.
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
10 Million USD-50 Million
Employee Number:
201~500
Ecer Certification：
Verified Supplier
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