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DuxPCB Technologies Co., Ltd.

  • China,Shenzhen
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China Goldfinger PCB Board Fabrication , IPC Class 3 PCB Manufacturing
China Goldfinger PCB Board Fabrication , IPC Class 3 PCB Manufacturing

  1. China Goldfinger PCB Board Fabrication , IPC Class 3 PCB Manufacturing
  2. China Goldfinger PCB Board Fabrication , IPC Class 3 PCB Manufacturing

Goldfinger PCB Board Fabrication , IPC Class 3 PCB Manufacturing

  1. MOQ: 1 pcs
  2. Price: 3–5 days for prototype, 7–10 days for mass production
  3. Get Latest Price
Payment Terms L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability 30,000㎡/month
Delivery Time 3–5 days for prototype, 7–10 days for mass production
Packaging Details Vacuum + anti-static bag + foam + outer carton
Name PCB Fabrication
Brand Name DUXPCB
Model Number Goldfinger PCB
Certification UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH.
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C,D/A,D/P,T/T,Western Union,MoneyGram Supply Ability 30,000㎡/month
Delivery Time 3–5 days for prototype, 7–10 days for mass production Packaging Details Vacuum + anti-static bag + foam + outer carton
Name PCB Fabrication Brand Name DUXPCB
Model Number Goldfinger PCB Certification UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH.
Place of Origin China
High Light Goldfinger PCB Board FabricationIPC Class 3 PCB Board FabricationIPC Class 3 PCB Manufacturing
Overview of Goldfinger PCB

DuxPCB provides world-class precision manufacturing for Goldfinger PCBs, the backbone of high-performance expansion cards and modular electronics. Our Advanced PCBA solutions integrate High-Density Interconnect (HDI) technology with robust edge-connector designs. Engineered for IPC Class 3 reliability, our boards feature a high-layer count stackup and controlled impedance to ensure flawless data transmission. Whether your design includes Fine pitch BGA or complex signal routing, our manufacturing process is optimized for the most demanding technical environments.

Key Technical Advantages
  • Enhanced Durability: Hard gold plating provides exceptional wear resistance for high-insertion cycle applications.
  • Signal Integrity: Controlled impedance ensures minimal signal reflection and loss at high frequencies.
  • Precision Engineering: Specialized precision manufacturing allows for Fine pitch BGA integration within high-layer count stackup designs.
  • Mission-Critical Quality: Adherence to IPC Class 3 reliability standards guarantees performance in extreme conditions.
  • Advanced Metallurgy: Support for electrolytic hard gold, ENIG, and ENEPIG to meet specific conductivity and solderability requirements.
Technical Capability Table
Feature Capability
Materials FR4, Rogers, Shengyi, Tuc, etc.
Max Layers 1-40L
Min. Hole Size 8mil/0.2mm
PCB thickness/hole size ratio Maximum: 12:1
Gold Thickness Hard Gold: 2 to 50µ"; ENIG: 1 to 5µ"
Board Thickness 0.2-8mm
Min. Trace Width 0.08mm
Min. Trace Space 0.08mm
Minimum space finger to beveling 0.15mm (to avoid damaging fingers)
Surface Finishing for Goldfinger Hard Gold (Electrolytic Gold), Immersion gold(ENIG), ENEPIG, ENIG+OSP, HASL+plating hard Gold, ENIG+plating hard Gold, OSP+plating hard Gold, etc.
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen White, Black, Red, Purple, etc.
Via Process Tenting Vias, Plugged Vias, Vias not covered
Test Fly Probe Testing (Free) and A.O.I. testing
Build time 5-10 days
Lead time 2-3 days
Certifications ISO 9001:2015, UL, ROHS, REACH
Quality Standards IPC A-600, IPC-6010
Why Choose DuxPCB?

1. Overcoming Complex Yield Barriers: Many fabricators struggle with yield loss on high-layer count stackup designs. DuxPCB utilizes advanced registration systems and vacuum lamination to ensure your complex multi-layer Goldfinger boards are delivered right the first time, every time.

2. Eliminating Field Failures: In Aerospace and Medical sectors, a single contact failure is catastrophic. We apply IPC Class 3 reliability protocols and rigorous AOI testing to ensure your Advanced PCBA solutions function flawlessly in life-critical environments.

3. Proactive Technical Consulting: Don't pay for preventable redesigns. Our engineers provide expert DFM consulting for Fine pitch BGA and controlled impedance layouts, identifying potential manufacturing bottlenecks before they impact your budget.

4. Scaling Without Delays: Moving from a difficult prototype to volume production often causes supply chain friction. DuxPCB bridges this gap with precision manufacturing workflows that scale seamlessly, maintaining 5-10 day build times regardless of complexity.

Frequently Asked Questions

What is the standard beveling angle for Goldfinger PCBs?
We typically provide 30-degree or 45-degree chamfering to ensure smooth insertion into the backplane connector. We maintain a minimum of 0.15mm space between the finger and the bevel to prevent damage.

Do you support both Hard Gold and ENIG on the same board?
Yes, we can perform selective plating, such as ENIG for component soldering and hard gold for the edge connectors, providing the best of both worlds for conductivity and durability.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2007

  • Total Annual:

    10 Million USD-50 Million

  • Employee Number:

    201~500

  • Ecer Certification:

    Verified Supplier

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Get in touch with us

  • Reach Us
  • DuxPCB Technologies Co., Ltd.
  • Room 201, Huamao Business Building, No. 69, Beiditang 1st Road, Shajing Street, Bao'an District, Shenzhen
  • https://www.duxpcb.com/

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