DuxPCB Technologies Co., Ltd.
| Payment Terms | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Supply Ability | 30,000㎡/month |
| Delivery Time | 3–5 days for prototype, 7–10 days for mass production |
| Packaging Details | Vacuum + anti-static bag + foam + outer carton |
| Name | High Speed PCB Design |
| Brand Name | DUXPCB |
| Model Number | High Speed PCB |
| Certification | UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union,MoneyGram | Supply Ability | 30,000㎡/month |
| Delivery Time | 3–5 days for prototype, 7–10 days for mass production | Packaging Details | Vacuum + anti-static bag + foam + outer carton |
| Name | High Speed PCB Design | Brand Name | DUXPCB |
| Model Number | High Speed PCB | Certification | UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. |
| Place of Origin | China | ||
| High Light | High Speed PCB Design Fabrication ，4 Layers PCB Design Fabrication ，Megtron PCB Design Fabrication | ||
In the era of 112Gbps SerDes and millimeter-wave communication, High Speed PCB architecture demands an uncompromising focus on Signal Integrity and Thermal Management. DuxPCB addresses these challenges through Advanced PCBA Solutions that integrate High-Density Interconnect (HDI) technology with precision material selection. Our expertise lies in managing electromagnetic interference (EMI) and crosstalk in high-layer-count environments by utilizing Any-layer HDI and sequential lamination. By deploying Laser Microvias and Stacked Vias, we facilitate the routing of Fine Pitch BGA components while ensuring robust vertical interconnect access. Every board is manufactured to meet IPC-6012 Class 3 standards, incorporating Controlled Impedance profiles with tolerances as tight as +/- 5 ohms. Whether for AI Server backplanes or 5G infrastructure, our process mitigates skin effect losses and dielectric absorption, providing stable performance across ultra-wide bandwidths.
| Item | Capability |
|---|---|
| Layers | 4-40 layers |
| Materials | Low loss/low Dk, high-performance FR-4, PPO, Teflon, hydrocarbon/ceramic filled |
| Minimum Trace width /Spacing | 2.5/2.5mil |
| Maximum Panel Size | 580mm x 1010mm |
| Surface Finish | plating NI/AU, plating hard Gold, ENIG, Immersion Tin, Immersion silver, OSP, ENIG+OSP |
| Aspect Ratio | Maximum 12:1 for plated through holes |
| Copper Thickness | Up to 12 oz on both sides |
| Solder Mask Thickness | Minimum 50μm |
| Routing Dielectric Thickness | 0.1mm - 3.0mm |
| Impedance | Minimum control of 50 ohms +/- 5 ohms |
| Drilling | Minimum mechanical drill diameter 0.15mm; Minimum laser drill diameter 0.075mm |
| Lead time | 7-15 business days |
| Certification | UL, RoHS, ISO 9001, ISO 13485, IATF 16949 |
| IPC Standard | IPC2141 |
Q1: How does DuxPCB ensure Signal Integrity at frequencies above 28GHz?
A: We utilize low-profile copper foils to minimize skin effect losses and specify low-Dk/Df laminates. Our controlled impedance testing utilizes TDR (Time Domain Reflectometry) and VNA (Vector Network Analyzer) to verify every trace against your design requirements.
Q2: Can you manufacture Any-layer HDI with stacked microvias?
A: Yes. Our capability includes sequential lamination and laser microvias that can be stacked up to 4+N+4 or any-layer configurations. We use specialized copper filling processes to ensure reliable electrical connections through the stack.
Q3: How do you handle heavy copper requirements alongside high-speed signals?
A: For designs requiring both high current and high-speed data, we offer hybrid constructions. This allows for up to 12 oz copper on power planes for thermal management while maintaining fine pitch geometry on signal layers.
Optimize your next high-difficulty project with DuxPCB's advanced manufacturing precision. Upload your Gerber files today for a comprehensive technical consultation and DFM review by our senior engineering team.
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
10 Million USD-50 Million
Employee Number:
201~500
Ecer Certification：
Verified Supplier
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