| Delivery Time | 7~15days |
| Capacity | 8GB-512GB |
| Read speed | Up to 330MB/s |
| Agreement | HS400 |
| Write speed | Up to 240MB/s |
| Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. |
| Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
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Product Specification
| Delivery Time | 7~15days | Capacity | 8GB-512GB |
| Read speed | Up to 330MB/s | Agreement | HS400 |
| Write speed | Up to 240MB/s | Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND | Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. | Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| High Light | Memory Card Chips Embedded ,EMMC 5.1 Memory Card Chips | ||
An embedded MultiMediaCard (eMMC) is a small storage device made up of NAND flash memory and a storage controller. The MultiMediaCard Association and JEDEC developed the eMMC standard for embedded flash memory applications in 2006.
The technology is intended for use in portable devices, such as cellphones and tablets, and more recently, it's being used in sensors connected to the internet of things (IoT). Both the flash memory and controller are contained on a single integrated circuit (IC) that's embedded permanently in a device.
| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature |
-25℃~85℃
|
-25℃~85℃
|
-25℃~85℃
|
-25℃~85℃
|
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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