| Payment Terms | L/C,T/T |
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Write Speed | 240MB/s |
| Protocol | HS400 |
| Warranty | 1 year |
| Manufacturer | PG Brand,China Chips Star |
| Product | EMMC |
| Storage Apacity | 16GB 8GB 4GB |
| Quality | 100% Original |
| Key Features | embedded EMMC |
| Brand Name | NUW |
| Model Number | G2504GPLCB/G2508GPLCB/G2516GPLCB |
| Place of Origin | Shenzhen, China |
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Product Specification
| Payment Terms | L/C,T/T | Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days | Write Speed | 240MB/s |
| Protocol | HS400 | Warranty | 1 year |
| Manufacturer | PG Brand,China Chips Star | Product | EMMC |
| Storage Apacity | 16GB 8GB 4GB | Quality | 100% Original |
| Key Features | embedded EMMC | Brand Name | NUW |
| Model Number | G2504GPLCB/G2508GPLCB/G2516GPLCB | Place of Origin | Shenzhen, China |
| High Light | PSLC ,eMMC5.1 ,Embedded Chip | ||
eMMC (Embedded Multi-Media Card) adopts an integrated BGA packaging design, integrating high-density NAND Flash memory chips and a dedicated flash controller into a single chip. No additional control modules are required, which greatly simplifies the design of terminal product storage solutions.
Its unified MMC standard interface effectively shields the process differences and compatibility issues of NAND Flash from different brands. Terminal manufacturers do not need to invest energy in handling complex technical problems such as bad block management and ECC verification. They can directly select eMMC chips with appropriate capacities, significantly shortening the R&D cycle of new products, reducing R&D costs, and accelerating the product launch rhythm.
The compact packaging size can save more motherboard space for small devices such as mobile phones, tablets, and smart wearables, adapting to various thin and light design needs.
| Model | G2504GPLCB | G2508GPLCB | G2516GPLCB |
|---|---|---|---|
| NAND Flash | PSLC | PSLC | PSLC |
| Capacity | 4GB | 8GB | 16GB |
| Warranty | 1 Year | 1 Year | 1 Year |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | 0℃~70℃ | 0℃~70℃ | 0℃~70℃ |
| EP | ≥10000 | ≥10000 | ≥10000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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