China Chips Star Semiconductor Co., Ltd.
| Supply Ability | 100K a month |
| Payment Terms | T/T,L/C |
| Delivery Time | 10 to 15 days |
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 |
| Brand Name | PG |
| Model Number | G2864GTLCB/G28128TLCB/G28256TLCB |
| Place of Origin | Shenzhen, China |
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Product Specification
| Supply Ability | 100K a month | Payment Terms | T/T,L/C |
| Delivery Time | 10 to 15 days | Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 | Brand Name | PG |
| Model Number | G2864GTLCB/G28128TLCB/G28256TLCB | Place of Origin | Shenzhen, China |
| High Light | LDPC ECC eMMC 5.1 ，Error Correction Embedded Flash ，64GB 128GB 256GB eMMC Chip | ||
This PG eMMC 5.1 embedded flash memory integrates a low-density parity-check (LDPC) based error correction engine inside the controller, delivering the correction strength that 3D TLC NAND requires at advanced process nodes. As NAND cells shrink and store more bits per cell, raw bit error rates climb, and only a powerful ECC scheme can keep stored data reliable over the life of the drive. The LDPC engine continuously monitors read and write operations, detects marginal cells, and corrects errors before they can affect the host system.
Offered in 64GB, 128GB and 256GB densities, this eMMC 5.1 memory is built for data intensive systems such as edge servers, network appliances, industrial PCs and medical instruments that write and rewrite data around the clock. The JEDEC eMMC 5.1 interface with HS400 mode keeps host integration simple, while the LDPC engine works invisibly in the background to protect files, logs and operating system images.
By moving complex flash management away from the host CPU, the on-board controller with LDPC ECC also reduces CPU overhead and power draw. The result is a storage component that combines high capacity, strong error correction and predictable performance for embedded designs that cannot afford silent data corruption.
| Model | Capacity | Protocol Standards | NAND | Package | Dimensions | Operating Temperature | Storage Temperature |
|---|---|---|---|---|---|---|---|
| G2864GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28128TLCB | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28256TLCB | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2819GPLCB | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2508GTLCB | 8GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2516GTLCB | 16GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2532GTLCB | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2564GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2504GPLCB | 4GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2508GPLCB | 8GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2516GPLCB | 16GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| Interface | eMMC 5.1, HS400 up to 400MB/s |
| Capacity | 64GB / 128GB / 256GB |
| NAND Flash | 3D TLC NAND |
| ECC | LDPC based ECC engine |
| Sequential Read | Up to 330MB/s |
| Sequential Write | Up to 240MB/s |
| Operating Temperature | -25C to +85C |
| Package | BGA153, 11.5 x 13 x 1.0mm |
| Voltage | VCC 3.3V / VCCQ 1.8V |
In real world deployments, an eMMC 5.1 with LDPC ECC keeps working correctly long after weaker ECC schemes start reporting errors. Every read operation passes through the LDPC engine, which evaluates the reliability of each cell and applies multi-pass correction when needed. For 3D TLC NAND with a high raw bit error rate, this LDPC ECC margin is what separates dependable embedded storage from silent data loss.
The benefit is visible in data intensive systems that run for years: databases stay consistent, firmware updates never corrupt, and event logs remain readable. Because the LDPC ECC engine operates inside the controller, the host CPU is freed from error handling, and power consumption stays low. For designers who cannot afford field failures, the LDPC ECC eMMC 5.1 is the engineering choice that protects both data and reputation.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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