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China Chips Star Semiconductor Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart
China High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart

  1. China High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart
  2. China High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart

High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart

  1. MOQ: 50pcs
  2. Price: Negotiable
  3. Get Latest Price
Manufacturer NUW Brand,China Chips Star
Packeage Type 153BGA
Payment Terms L/C,T/T
Aplication Smart Wearable
Condition New
Delivery Time 3 to 15 days
Write Speed 240MB/S
Supply Ability 100K a month
Error Correction Built-in ECC (Error Correction Code)
Material plastic
Chip Hynix V7
Protocol HS400
Sequential Write Speed Up To 240 MB/s
Place of Origin Shenzhen, China
Brand Name PG

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  1. Product Details
  2. Company Details

Product Specification

Manufacturer NUW Brand,China Chips Star Packeage Type 153BGA
Payment Terms L/C,T/T Aplication Smart Wearable
Condition New Delivery Time 3 to 15 days
Write Speed 240MB/S Supply Ability 100K a month
Error Correction Built-in ECC (Error Correction Code) Material plastic
Chip Hynix V7 Protocol HS400
Sequential Write Speed Up To 240 MB/s Place of Origin Shenzhen, China
Brand Name PG
High Light pSLC eMMC ModuleHigh Endurance pSLC TechnologySmart Wearable Memory Solution
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable

The High Endurance pSLC eMMC Module with 153 Ball FBGA Package is a high-reliability embedded storage solution designed for smart wearables, IoT devices, medical wearable equipment, industrial terminals, and edge AI applications.

Based on eMMC 5.1 interface technology, this module integrates NAND Flash and an intelligent controller with advanced LDPC ECC error correction, wear leveling, bad block management, and optimized firmware algorithms. The pSLC mode enhances endurance and data reliability compared with traditional TLC NAND, making it suitable for devices requiring frequent data writing, long operating cycles, and stable performance.

Embedded eMMC 5.1 Specifications
Parameter Specification
Product Type Embedded Multimedia Card (eMMC IC Chip)
Application Smart Wearable / Smart Display
Capacity 4GB / 8GB / 16GB / 32GB / 64GB
Interface eMMC 5.1
NAND Flash Type 3D NAND Flash
Package BGA153
Error Correction LDPC ECC
Operating Voltage 1.8V / 3.3V
Performance Mode HS400 Supported
Data Protection ECC, Wear Leveling, Bad Block Management
Operating Temperature Commercial: 0°C to 70°C / Industrial Option: -25°C to 85°C
Storage Temperature -25°C to 85°C
Form Factor Embedded IC Package 153
Application Life Cycle Long-term Supply Support
Why Choose China Chips Star?
Professional Embedded Storage Manufacturer

China Chips Star Semiconductor specializes in:

  • eMMC 5.1 storage solutions
  • Industrial memory cards
  • Automotive-grade storage
  • NAND Flash storage products

With dedicated R&D and testing capabilities, China Chips Star provides customized embedded storage solutions for global customers.

High-Endurance Storage Technology

China Chips Star develops storage solutions based on advanced NAND management technologies:

  • pSLC mode optimization
  • LDPC ECC algorithm
  • Flash lifetime management
  • Firmware optimization

Providing higher reliability for write-intensive applications.

Product Images
eMMC IC Chip close-up view showing BGA package and component details

eMMC IC Chip mounted on PCB board for digital advertising applications

eMMC storage module technical specifications and labeling

eMMC IC Chip packaging and industrial application context

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    260~300

  • Ecer Certification:

    Verified Supplier

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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Get in touch with us

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  • China Chips Star Semiconductor Co., Ltd.
  • Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
  • https://www.emmcmemorycard.com/

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