China Chips Star Semiconductor Co., Ltd.
| Supply Ability | 100K Pieces per Month |
| Available Capacities | 64GB, 128GB |
| Operating Temperature | -40°C to +105°C |
| Security | RPMB, secure boot, write protection |
| Package | BGA 153 |
| Packaging Details | Anti-static tray packaging, export-grade corrugated carton |
| NAND Flash | MLC / TLC / QLC |
| Package Size | 11.5 x 13 x 1 mm |
| Manufacturer | PG |
| Delivery Time | 3 to 5 Days |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Payment Terms | L/C,T/T |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Interface | eMMC 5.1 with HS400 support |
| Condition | New |
| Place of Origin | China |
| Brand Name | PG |
| Certification | AEC-Q100 |
| Model Number | eMMC 5.1 BGA153 HS400 |
View Detail Information
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Product Specification
| Supply Ability | 100K Pieces per Month | Available Capacities | 64GB, 128GB |
| Operating Temperature | -40°C to +105°C | Security | RPMB, secure boot, write protection |
| Package | BGA 153 | Packaging Details | Anti-static tray packaging, export-grade corrugated carton |
| NAND Flash | MLC / TLC / QLC | Package Size | 11.5 x 13 x 1 mm |
| Manufacturer | PG | Delivery Time | 3 to 5 Days |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) | Payment Terms | L/C,T/T |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) | Interface | eMMC 5.1 with HS400 support |
| Condition | New | Place of Origin | China |
| Brand Name | PG | Certification | AEC-Q100 |
| Model Number | eMMC 5.1 BGA153 HS400 | ||
| High Light | Automotive Grade eMMC 5.1 ，HS400 High Speed Embedded Storage ，Wide Temperature BGA153 Flash Memory | ||
This automotive-grade eMMC 5.1 embedded flash storage is purpose-built for demanding onboard electronic systems. Compliant with the JEDEC eMMC 5.1 standard and qualified for automotive applications, it delivers consistent high-speed performance, long-term data integrity, and reliable operation across extreme temperature ranges. Its compact BGA153 package and scalable capacity options make it the ideal storage foundation for next-generation vehicle electronics.
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 64GB, 128GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Operating Temperature | -40°C to +105°C |
| NAND Flash | MLC / TLC / QLC |
| Security | RPMB, secure boot, write protection |
| Package | BGA 153 (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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