China Chips Star Semiconductor Co., Ltd.
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Payment Terms | T/T,L/C |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 |
| Place of Origin | Shenzhen, China |
| Model Number | G2864GTLCB/G28128TLCB/G28256TLCB |
| Brand Name | PG |
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Product Specification
| Supply Ability | 100K a month | Delivery Time | 10 to 15 days |
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton | Payment Terms | T/T,L/C |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 | Place of Origin | Shenzhen, China |
| Model Number | G2864GTLCB/G28128TLCB/G28256TLCB | Brand Name | PG |
| High Light | 100% Original OEM eMMC ，Genuine NAND Flash IC ，64GB 128GB 256GB eMMC 5.1 | ||
Recycled flash memory poses significant hidden risks in embedded electronics. Our PG eMMC 5.1 is manufactured using 100% original, brand new NAND flash sourced directly from qualified wafer partners, ensuring system integrators receive genuine components with full traceability and consistent quality.
Every production batch includes comprehensive inspection records confirming original die sourcing, packaging dates, and factory test results.
| Model | Capacity | Protocol Standards | NAND | Package | Dimensions | Operating Temperature | Storage Temperature |
|---|---|---|---|---|---|---|---|
| G2864GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28128TLCB | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28256TLCB | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2819GPLCB | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2864GTLIA | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~85℃ | -50℃~125℃ |
| G28128TLIA | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~85℃ | -50℃~125℃ |
| G28256TLIA | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~85℃ | -50℃~125℃ |
| G2864GTLIH | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G28128TLIH | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G28256TLIH | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G2864GTLCA | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G28128TLCA | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G28256TLCA | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G2819GPLCA | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G2508GTLCB | 8GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2516GTLCB | 16GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2532GTLCB | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2564GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2504GPLCB | 4GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2508GPLCB | 8GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2516GPLCB | 16GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| Interface | eMMC 5.1, HS400 mode |
| Capacity | 64GB / 128GB / 256GB |
| NAND Flash | 100% Original 3D TLC NAND |
| Quality Grade | A-Grade, brand new |
| Sequential Read | Up to 330MB/s |
| Sequential Write | Up to 240MB/s |
| Operating Temperature | -25℃ to +85℃ |
| Package | BGA153, 11.5 x 13 x 1.0mm |
| Traceability | Lot level, batch records available |
Original components begin with an auditable supply chain. PG sources NAND wafers directly from qualified partners, and every eMMC 5.1 module is assembled, tested and traced in our own facility. This comprehensive control eliminates risks associated with recycled dies, re-marked parts, or capacity mismatches common in gray market components.
For OEM buyers, receiving 100 percent original eMMC 5.1 memory ensures the products they ship maintain the quality standards they promise to their customers.
Quality control extends beyond assembly: each unit undergoes programming, speed testing, bad block checking, and capacity verification before packaging. Batch records enable complete traceability from finished modules back to original wafer lots, providing data-driven answers to any quality inquiries. Original quality represents a comprehensive process, and our eMMC 5.1 embodies the results of this rigorous approach.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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