China Chips Star Semiconductor Co., Ltd.
| Supply Ability | 100K a month |
| Command Queueing | Supported |
| Delivery Time | 10 to 15 days |
| Storage Capacity | 64GB/128GB/256GB/32GB |
| Nand Flash Type | 3D NAND |
| Warranty | 1 Year |
| Choice Of Flash | TLC/PSLC |
| Reliability | Enhanced ECC (Error Correction Code) |
| Custom | Support |
| Payment Terms | T/T,L/C |
| Condition | new |
| Origin | Shenzhen |
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Place of Origin | Shenzhen, China |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 |
| Brand Name | PG |
| Model Number | G2832GTLCB/G2864GTLCB/G28128TLCB |
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Product Specification
| Supply Ability | 100K a month | Command Queueing | Supported |
| Delivery Time | 10 to 15 days | Storage Capacity | 64GB/128GB/256GB/32GB |
| Nand Flash Type | 3D NAND | Warranty | 1 Year |
| Choice Of Flash | TLC/PSLC | Reliability | Enhanced ECC (Error Correction Code) |
| Custom | Support | Payment Terms | T/T,L/C |
| Condition | new | Origin | Shenzhen |
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton | Place of Origin | Shenzhen, China |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 | Brand Name | PG |
| Model Number | G2832GTLCB/G2864GTLCB/G28128TLCB | ||
| High Light | Dual Voltage eMMC 5.1 ，1.8V 3.3V Embedded Flash ，128GB eMMC5.1 | ||
Different host platforms use different I/O voltage domains, and an eMMC that only supports one voltage can force costly level shifting or board redesign. This PG eMMC 5.1 supports dual voltage operation with VCC at 3.3V and VCCQ at 1.8V, covering the two most common power rails in embedded designs. That flexibility simplifies the BOM and lets one memory part serve multiple products in a portfolio.
Available in 32GB, 64GB and 128GB densities, the device is compliant with the JEDEC eMMC 5.1 specification and supports HS400 mode in both voltage configurations. Design teams can qualify one part and reuse it across set top boxes, tablets, IoT gateways, industrial boards and consumer electronics that run on different voltage domains.
Dual voltage support does not compromise reliability: the device still includes LDPC ECC, wear leveling, bad block management and wide temperature operation. The BGA153 package keeps the footprint standard, so the same board layout works across the capacity and voltage range.
| Model | Capacity | Protocol Standards | NAND | Package | Dimensions | Operating Temperature | Storage Temperature |
|---|---|---|---|---|---|---|---|
| G2864GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28128TLCB | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28256TLCB | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2819GPLCB | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2508GTLCB | 8GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2516GTLCB | 16GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2532GTLCB | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2564GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2504GPLCB | 4GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2508GPLCB | 8GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2516GPLCB | 16GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| Interface | eMMC 5.1, HS400 mode |
| Capacity | 32GB / 64GB / 128GB |
| Operating Voltage | VCC 3.3V, VCCQ 1.8V |
| NAND Flash | 3D TLC NAND |
| Sequential Read | Up to 300MB/s |
| Sequential Write | Up to 220MB/s |
| Operating Temperature | -25C to +85C |
| Package | BGA153, 11.5 x 13 x 1.0mm |
Design teams often maintain separate BOMs for platforms with different voltage domains, multiplying qualification effort and inventory cost. This dual voltage eMMC 5.1 collapses that complexity: the same part operates at 3.3V VCC and 1.8V VCCQ, so a single qualification covers set top boxes, tablets, gateways and industrial boards across the product line.
Dual voltage support is implemented without compromising performance or reliability. HS400 speed, LDPC ECC, wear leveling and wide temperature operation are all available in both voltage configurations, and the BGA153 package means the board layout is identical across capacities. Fewer part numbers, simpler logistics and faster time to market: that is the value of this dual voltage eMMC 5.1.
The dual voltage eMMC 5.1 simplifies inventory because one 32GB, 64GB or 128GB part number serves platforms running on either 1.8V or 3.3V I/O, reducing qualification cost and stock keeping units across the product family.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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