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China Chips Star Semiconductor Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Customizable OEM eMMC 5.1 64GB 128GB 256GB Firmware Customization Embedded
China Customizable OEM eMMC 5.1 64GB 128GB 256GB Firmware Customization Embedded

  1. China Customizable OEM eMMC 5.1 64GB 128GB 256GB Firmware Customization Embedded

Customizable OEM eMMC 5.1 64GB 128GB 256GB Firmware Customization Embedded

  1. MOQ: 50 Pieces
  2. Price: Negotiable
  3. Get Latest Price
Packaging Details Anti-static tray + vacuum sealed bag, export-grade carton
Supply Ability 100K a month
Delivery Time 10 to 15 days
Payment Terms T/T,L/C
Place of Origin Shenzhen, China
Brand Name PG
Model Number G2864GTLCB/G28128TLCB/G28256TLCB
Certification CE, RoHS, ISO9001,AEC-Q100,IATF16949

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  1. Product Details
  2. Company Details

Product Specification

Packaging Details Anti-static tray + vacuum sealed bag, export-grade carton Supply Ability 100K a month
Delivery Time 10 to 15 days Payment Terms T/T,L/C
Place of Origin Shenzhen, China Brand Name PG
Model Number G2864GTLCB/G28128TLCB/G28256TLCB Certification CE, RoHS, ISO9001,AEC-Q100,IATF16949
High Light Customizable OEM eMMC 5.1Firmware Customization Storage64GB 128GB 256GB eMMC
Customizable OEM eMMC 5.1 64GB 128GB 256GB Firmware Customization Embedded Storage
Customizable OEM eMMC 5.1 Embedded Storage

Off-the-shelf memory is not always enough. Some products need specific firmware behavior, custom capacity points, private labeling or special testing. This PG eMMC 5.1 program is built around customization: we support firmware parameter adjustment, customer part numbering, custom silkscreen and labeling, and tailored qualification tests for volume OEM programs.

The base platform is a JEDEC eMMC 5.1 device with HS400 support in 64GB, 128GB and 256GB densities, built on 3D TLC NAND with LDPC ECC. Customization is applied at the factory before delivery, so the host system sees a standard eMMC interface while receiving the specific behavior the customer requires.

PG works directly with system integrators and brand owners to define the right configuration for each application, from industrial controllers to consumer electronics. With flexible MOQ and a controlled supply chain, the customizable eMMC 5.1 gives product teams the differentiation they need without compromising quality.

Product Models
Model Capacity Protocol Standards NAND Package Dimensions Operating Temperature Storage Temperature
G2864GTLCB 64GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -25℃~85℃ -40℃~105℃
G28128TLCB 128GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -25℃~85℃ -40℃~105℃
G28256TLCB 256GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -25℃~85℃ -40℃~105℃
G2819GPLCB 19GB eMMC 5.1 pSLC FBGA153 11.5*13mm -25℃~85℃ -40℃~105℃
G2508GTLCB 8GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -0℃~70℃ -45℃~85℃
G2516GTLCB 16GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -0℃~70℃ -45℃~85℃
G2532GTLCB 32GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -0℃~70℃ -45℃~85℃
G2564GTLCB 64GB eMMC 5.1 3D TLC FBGA153 11.5*13mm -0℃~70℃ -45℃~85℃
G2504GPLCB 4GB eMMC 5.1 pSLC FBGA153 11.5*13mm -25℃~85℃ -40℃~85℃
G2508GPLCB 8GB eMMC 5.1 pSLC FBGA153 11.5*13mm -25℃~85℃ -40℃~85℃
G2516GPLCB 16GB eMMC 5.1 pSLC FBGA153 11.5*13mm -25℃~85℃ -40℃~85℃
Technical Specifications
Interface eMMC 5.1, HS400 mode
Capacity 64GB / 128GB / 256GB
NAND Flash 3D TLC NAND
Customization Firmware, labeling, packaging
Service OEM / ODM support
MOQ Flexible for volume programs
Operating Temperature -25C to +85C
Package BGA153
Key Advantages
  • Firmware parameter customization for application specific behavior
  • Private labeling and customer part numbering supported
  • Custom qualification and testing options for volume programs
  • Factory level configuration ensures consistent quality
  • Flexible MOQ for OEM and ODM projects
  • Full eMMC 5.1 compliance with standard BGA153 footprint
Customizable eMMC 5.1 embedded storage component eMMC 5.1 storage module close-up view Industrial eMMC storage solution packaging
Storage Tailored to Your Product

A customized eMMC 5.1 starts with understanding the application. PG engineers work with customers to define firmware parameters such as power on behavior, cache settings and temperature thresholds, and to select the right capacity and NAND configuration for the workload. The result is storage that behaves exactly as the product design requires, rather than the closest standard part.

Customization extends beyond firmware to the physical component: private labeling, customer part numbers and customized packaging make the memory part look and behave like your own. Factory level configuration means every delivered unit matches the approved sample, with test data available for audit. For brand owners who want differentiation without risk, this customizable eMMC 5.1 program delivers.

From the first engineering sample to volume production, the customizable eMMC 5.1 program keeps firmware revisions documented and every delivered lot traceable to the approved configuration, so custom storage remains a low risk decision for OEM teams.

Whether you need a custom capacity point, a custom firmware profile or custom labeling, the PG team delivers a customized eMMC 5.1 that fits your product exactly, and the OEM documentation supports your own quality approval process.

Frequently Asked Questions
Q: What can be customized on this eMMC?
A: Firmware parameters, capacity configuration, labeling, packaging and qualification testing can all be customized for volume programs.
Q: What is the MOQ for custom orders?
A: MOQ is flexible and depends on the customization scope. Please contact us with your program details for a specific quote.
Q: Does customization affect eMMC 5.1 compatibility?
A: No, customization is applied at the factory level and the device remains fully JEDEC eMMC 5.1 compatible with the host interface.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    260~300

  • Ecer Certification:

    Verified Supplier

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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  • China Chips Star Semiconductor Co., Ltd.
  • Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
  • https://www.emmcmemorycard.com/

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