| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Payment Terms | T/T,L/C |
| Place of Origin | Shenzhen, China |
| Brand Name | PG |
| Model Number | G2864GTLCB/G28128TLCB/G28256TLCB |
| Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 |
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Product Specification
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton | Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days | Payment Terms | T/T,L/C |
| Place of Origin | Shenzhen, China | Brand Name | PG |
| Model Number | G2864GTLCB/G28128TLCB/G28256TLCB | Certification | CE, RoHS, ISO9001,AEC-Q100,IATF16949 |
| High Light | Customizable OEM eMMC 5.1 ,Firmware Customization Storage ,64GB 128GB 256GB eMMC | ||
Off-the-shelf memory is not always enough. Some products need specific firmware behavior, custom capacity points, private labeling or special testing. This PG eMMC 5.1 program is built around customization: we support firmware parameter adjustment, customer part numbering, custom silkscreen and labeling, and tailored qualification tests for volume OEM programs.
The base platform is a JEDEC eMMC 5.1 device with HS400 support in 64GB, 128GB and 256GB densities, built on 3D TLC NAND with LDPC ECC. Customization is applied at the factory before delivery, so the host system sees a standard eMMC interface while receiving the specific behavior the customer requires.
PG works directly with system integrators and brand owners to define the right configuration for each application, from industrial controllers to consumer electronics. With flexible MOQ and a controlled supply chain, the customizable eMMC 5.1 gives product teams the differentiation they need without compromising quality.
| Model | Capacity | Protocol Standards | NAND | Package | Dimensions | Operating Temperature | Storage Temperature |
|---|---|---|---|---|---|---|---|
| G2864GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28128TLCB | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28256TLCB | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2819GPLCB | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2508GTLCB | 8GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2516GTLCB | 16GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2532GTLCB | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2564GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2504GPLCB | 4GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2508GPLCB | 8GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2516GPLCB | 16GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| Interface | eMMC 5.1, HS400 mode |
| Capacity | 64GB / 128GB / 256GB |
| NAND Flash | 3D TLC NAND |
| Customization | Firmware, labeling, packaging |
| Service | OEM / ODM support |
| MOQ | Flexible for volume programs |
| Operating Temperature | -25C to +85C |
| Package | BGA153 |
A customized eMMC 5.1 starts with understanding the application. PG engineers work with customers to define firmware parameters such as power on behavior, cache settings and temperature thresholds, and to select the right capacity and NAND configuration for the workload. The result is storage that behaves exactly as the product design requires, rather than the closest standard part.
Customization extends beyond firmware to the physical component: private labeling, customer part numbers and customized packaging make the memory part look and behave like your own. Factory level configuration means every delivered unit matches the approved sample, with test data available for audit. For brand owners who want differentiation without risk, this customizable eMMC 5.1 program delivers.
From the first engineering sample to volume production, the customizable eMMC 5.1 program keeps firmware revisions documented and every delivered lot traceable to the approved configuration, so custom storage remains a low risk decision for OEM teams.
Whether you need a custom capacity point, a custom firmware profile or custom labeling, the PG team delivers a customized eMMC 5.1 that fits your product exactly, and the OEM documentation supports your own quality approval process.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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