| Highlight | HS400 eMMC Embedded Memory IC, Automotive eMMC Embedded Memory IC |
| Payment Terms | L/C,T/T |
| Interface | HS400, HS200, HS, DDR |
| Delivery Time | 3 to 5 days |
| Supply Ability | 100K a month |
| Operating Temperature | 0°C To +70°C |
| Nand Flash | MLC/TLC/QLC |
| color | black |
| Condition | New |
| Model Number | eMMC 5.1 with HS400 support |
| Place of Origin | China |
| Brand Name | PG |
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Product Specification
| Highlight | HS400 eMMC Embedded Memory IC, Automotive eMMC Embedded Memory IC | Payment Terms | L/C,T/T |
| Interface | HS400, HS200, HS, DDR | Delivery Time | 3 to 5 days |
| Supply Ability | 100K a month | Operating Temperature | 0°C To +70°C |
| Nand Flash | MLC/TLC/QLC | color | black |
| Condition | New | Model Number | eMMC 5.1 with HS400 support |
| Place of Origin | China | Brand Name | PG |
| High Light | PSLC eMMC , eMMC , eMMC 5.1 | ||
Our high-endurance pSLC eMMC 5.1 embedded memory chips are available in 4GB, 8GB, and 16GB capacities. Adopting a standard 153-ball FBGA package, the product fully complies with JEDEC eMMC 5.1 specifications.
Built on pSLC technology, the chip configures NAND flash cells for single-bit data storage and achieves up to 30,000 P/E cycles, significantly outperforming conventional TLC eMMC (around 3,000 P/E cycles). This pSLC eMMC 5.1 is engineered for embedded scenarios demanding frequent write operations and outstanding operational stability.
pSLC architecture delivers exceptional write endurance, perfect for 24/7 continuous video storage applications.
The compact BGA153 package supports miniaturized monitoring hardware design and space-constrained applications.
Stores HD video streams and supports loop recording, guaranteeing reliable data preservation during critical events.
Supports simultaneous multi-channel video writing, stable 7*24-hour surveillance data storage, as well as rapid data search and playback.
Stores access logs and facial recognition data. Low power consumption makes it ideal for battery-operated access control equipment.
eMMC 5.1 with HS400 high-speed mode, maximum transfer speed up to 400MB/s
4GB, 8GB, 16GB
BGA153 (11.5*13.0mm), compatible with most mainstream embedded mainboards
pSLC technology supports 30,000 P/E cycles to greatly prolong device service life
Integrated ECC error correction, bad block management, and wear leveling algorithms to protect data integrity
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 32GB, 64GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Operating Temperature | 0°C to 70°C |
| Package Size | 11.5 x 13 x 1 mm |
| Package | BGA 153 (Ball Grid Array) |
Integrated PSLC NAND flash and onboard controller streamline circuit design and lower overall BOM cost, perfectly suited for mass-production consumer electronic devices.
Rated for a standard consumer temperature range of 0°C to 70°C, this eMMC chip delivers consistent and reliable operation in daily indoor and regular consumer scenarios.
Fully compliant with universal eMMC 5.1 interface standards, enabling simple design adoption and faster time-to-market for embedded consumer products.
Available in 4GB, 8GB and 16GB capacities to precisely match the basic storage requirements of mainstream lightweight smart devices.
Featuring optimized power consumption and a compact BGA153 package, it fits perfectly for space-limited, battery-powered consumer electronics with high energy efficiency demands.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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