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{"title":"EMMC 5.1 High Concurrent Task eMMC 5.1 Storage Chip For Gate Access Control","imgUrl":"https:\/\/img.chinax.com\/nimg\/4c\/b0\/52588f8df23b65281291c9f131b2-200x200-1\/emmc_5_1_high_concurrent_task_emmc_5_1_storage_chip_for_gate_access_control_terminal.jpg","attrs":{"Place of Origin":"Shenzhen, China","Command Set":"MMC command set with extended commands","Model Number":"G2832GTLCB\/ G2864GTLCB \/ G28128TLCB \/ G28256TLCB","Working Temperature":"-25~85\u2103"}}
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eMMC 5.1 Industrial Grade eMMC 5.1 Flash Storage Chip Wide Temperature Support
Product Overview
Industrial-grade eMMC 5.1 flash storage chip designed for demanding environments with wide temperature support and robust reliability features.
Key Features
Standard eMMC 5.1 Protocol Compliance
Fully follows JEDEC eMMC 5.1 official standard protocol, compatible with mainstream embedded main control chips. Plug-and-play functionality eliminates extra driver development, reducing hardware adaptation cycle for embedded equipment.
-40℃~85℃ Wide Temperature Operation Range
Custom industrial temperature control particle design ensures stable read-write performance under ultra-low and high temperature environments. Ideal for outdoor monitoring and vehicle-mounted equipment with no data loss or speed degradation.
Built-in Advanced Wear Leveling Algorithm
Intelligent dynamic block wear balancing technology evenly distributes erase and write times across storage blocks, extending chip service life and preventing local block over-ablation damage.
Hardware Power Failure Protection Mechanism
Independent power-off backup circuit design provides real-time cache data storage during sudden power cuts, preventing file corruption and system crashes caused by abnormal power supply.
Multiple Storage Capacity Options
Available in 8GB/16GB/32GB/64GB capacities with unified pin definition, allowing customers to switch capacities without redesigning PCB layouts for flexible mass production matching.
High Shock & Vibration Resistance Structure
Encapsulated with high-strength plastic packaging material, passing 1000G impact and 10-2000Hz vibration tests. Suitable for bumpy vehicle and portable industrial handheld terminal applications.
Technical Specifications
Model
G2864TLIH/G28128TLIH/G28256TLIH
Capacity
64GB / 128GB / 256GB
Brand
PG
Wafer
KIOXIA
Package Type
BGA153
Read Speed
330 MB/s
Write Speed
240 MB/s
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
