China Chips Star Semiconductor Co., Ltd.
| Packaging Details | Default packaging or customized packaging |
| Form Factor | BGA (Ball Grid Array) |
| Oem Odm | Support |
| Payment Terms | L/C,T/T |
| Error Correction | Built-in ECC (Error Correction Code) |
| Wafer | KIOXIA |
| Use Case | T-Box Vehicle Telematics |
| Capacity Options | 64GB, 128GB, 256GB |
| Supply Ability | 100K a month |
| Security Features | Secure trim, secure erase, and password protection |
| Package Type | BGA (Ball Grid Array) |
| Delivery Time | 3 to 15 days |
| Model Number | G28256TLCA |
| Place of Origin | Shenzhen, China |
| Brand Name | PG |
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Product Specification
| Packaging Details | Default packaging or customized packaging | Form Factor | BGA (Ball Grid Array) |
| Oem Odm | Support | Payment Terms | L/C,T/T |
| Error Correction | Built-in ECC (Error Correction Code) | Wafer | KIOXIA |
| Use Case | T-Box Vehicle Telematics | Capacity Options | 64GB, 128GB, 256GB |
| Supply Ability | 100K a month | Security Features | Secure trim, secure erase, and password protection |
| Package Type | BGA (Ball Grid Array) | Delivery Time | 3 to 15 days |
| Model Number | G28256TLCA | Place of Origin | Shenzhen, China |
| Brand Name | PG | ||
| High Light | Automotive Grade AEC-Q100 eMMC 5.1 ，-40℃~105℃ Grade2 Automotive eMMC ，Automotive eMMC for IVI ADAS T-BOX | ||
Fully compliant with automotive electronic industry specifications and certified with high-standard automotive-grade reliability, this product adapts to core vehicle scenarios including automotive central control, driving recorders, vehicle navigation, smart cockpits and autonomous driving assistance systems. Optimized for complex vehicle operating characteristics such as frequent start-stop and continuous vibration, its architecture perfectly adapts to complex vehicle operating environments and meets stringent high stability and compatibility requirements of automotive electronics for storage chips.
Adopting differentiated layered capacity design, 8GB-16GB small-capacity versions are suitable for vehicle system firmware and basic program storage, while 64GB-256GB large-capacity versions meet high-capacity storage demands of high-definition driving video recording, vehicle audio and video resources, driving data caching and intelligent algorithm data storage. The capacity specifications fully cover basic vehicle systems and advanced smart vehicle applications, balancing practicality and cost performance, and adapting to storage upgrade demands of different vehicle models and configurations.
Equipped with exclusive automotive data security protection mechanisms, it features instant power-off data protection, encrypted data storage and fault log retention, completely retaining core vehicle information including driving data, fault data and driving records. Optimized for core automotive data requirements of non-tampering and traceability, it avoids accidental deletion, loss and tampering of data, providing reliable data support for vehicle fault troubleshooting, driving safety traceability and intelligent driving data analysis.
Optimized with an automotive start-stop adaptation algorithm, it withstands frequent vehicle start-stops, instantaneous voltage fluctuations and body bumps and vibrations, eliminating storage failure and data interruption during start-stop moments. Its operating temperature ranges from -40℃ to 95℃, covering common vehicle temperature environments, adapting to extreme vehicle conditions such as high temperature in summer exposure and low temperature in winter. It maintains no performance attenuation during long-term operation, ensuring all-weather stable operation of smart cockpits, driving monitoring and assisted driving systems.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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