China Chips Star Semiconductor Co., Ltd.
| Product | Automotive eMMC 5.1 |
| Oem | Welcome |
| Choice Of Flash | MLC / 3D TLC / QLC NAND |
| Delivery Time | 3 to 15 days |
| Packaging Details | Default packaging or customized packaging |
| Use Case | Telematics Control Unit TCU |
| Read Speed | Up To 330MB/S |
| Supply Ability | 100K a month |
| Form Factor | BGA (Ball Grid Array) |
| Write Speed | Up to 240 MB/s |
| Custom | Support |
| Factory | Yes |
| Payment Terms | L/C,T/T |
| Packeage Type | 153BGA |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
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eMMC 5.1 Automotive Grade Operating Stably in the Range of -40℃~105℃ BGA 153
Product Specification
| Product | Automotive eMMC 5.1 | Oem | Welcome |
| Choice Of Flash | MLC / 3D TLC / QLC NAND | Delivery Time | 3 to 15 days |
| Packaging Details | Default packaging or customized packaging | Use Case | Telematics Control Unit TCU |
| Read Speed | Up To 330MB/S | Supply Ability | 100K a month |
| Form Factor | BGA (Ball Grid Array) | Write Speed | Up to 240 MB/s |
| Custom | Support | Factory | Yes |
| Payment Terms | L/C,T/T | Packeage Type | 153BGA |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| High Light | eMMC for TCU System ，Extreme Temp Resistant eMMC ，Extreme Temp Resistant eMMC | ||
Automotive EMMC For T-Box EMMC 64GB 128GB BGA153 For Vehicle Telematics
China Chips Star PG brand automotive-grade eMMC (e.g. G2864GTLCA) is customized exclusively for automotive control units including TCU and T-BOX. Telematics Control Unit (TCU), the hub of vehicle telematics for smart vehicles, undertakes five core functions: vehicle data collection, remote monitoring, OTA updates, V2X communication and fault log storage. Its storage device must withstand harsh automotive operating environments and deliver superior stability.
The full product line is certified to AEC-Q100, supporting operating temperature from -40℃ to 105℃. Equipped with LDPC hardware ECC & power failure protection, preventing system damage caused by interrupted OTA upgrades or data writing.
Compact package: 153-ball BGA form factor, suitable for compact PCB layout of TCU modules. Ultra-low power consumption: Auto sleep mode designed for vehicle battery energy-saving scenarios.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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