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China Chips Star Semiconductor Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB
China EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB

  1. China EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB
  2. China EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB
  3. China EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB

EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB

  1. MOQ: 50pcs
  2. Price: Negotiable
  3. Get Latest Price
Partitioning Supports multiple partitions including RPMB (Replay Protected Memory Block)
Working Temperature -25~85℃
Payment Terms L/C,T/T
Command Queueing Supported
Product EMMC
Packaging Details Default packaging or customized packaging
Delivery Time 3 to 15 days
Read Speed Up To 330MB/S
Enhanced Strobe Supported
Supply Ability 100K a month
Agreement HS400
Interface MMC (MultiMediaCard) interface
Factory Yes
Brand Name PG
Place of Origin Shenzhen, China
Model Number S28256TLCB

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  1. Product Details
  2. Company Details

Product Specification

Partitioning Supports multiple partitions including RPMB (Replay Protected Memory Block) Working Temperature -25~85℃
Payment Terms L/C,T/T Command Queueing Supported
Product EMMC Packaging Details Default packaging or customized packaging
Delivery Time 3 to 15 days Read Speed Up To 330MB/S
Enhanced Strobe Supported Supply Ability 100K a month
Agreement HS400 Interface MMC (MultiMediaCard) interface
Factory Yes Brand Name PG
Place of Origin Shenzhen, China Model Number S28256TLCB
High Light emmc icemmc 5.1emmc storage card
EMMC 5.1 High Speed EMMC Memory IC Full Capacity Compatible For Smart Devices
Consumer-Grade High-Performance eMMC 5.1 Product
High-Speed Transmission Performance for Smooth Operation

Complying strictly with the JEDEC eMMC 5.1 industry standard, this product supports the HS400 high-speed transmission mode with a theoretical peak transmission rate of 400MB/s. It achieves maximum measured sequential read speeds of 330MB/s and sequential write speeds of 290MB/s, efficiently meeting the high-frequency data read-write demands of terminal devices.

  • Enables rapid APP installation and high-definition video loading
  • Supports large-scale game operation without stuttering
  • Eliminates device loading delays and improves operation fluency
  • Well adapted to lightweight and high-frequency workloads of civilian terminals
Full-Gradient Capacities for Diverse Scenarios

The product covers a complete capacity range from 4GB to 256GB, including entry-level small-capacity and high-end large-capacity versions.

  • Small-capacity versions meet basic system storage and lightweight application installation needs
  • Large-capacity versions support high-definition audio and video storage
  • Enables multi-program background operation and mass storage of photos and videos
  • Precisely matches smartphones, tablets, smart wearable devices, and home set-top boxes
Low-Power Energy-Saving Design for Extended Battery Life

Equipped with an intelligent power consumption regulation algorithm that supports automatic sleep and dynamic frequency modulation functions.

  • Automatically reduces power consumption in standby mode
  • Adjusts performance-power consumption ratio on demand during operation
  • Significantly reduces power loss compared to traditional storage chips
  • Effectively extends battery life of handheld mobile devices
  • Avoids power overload and overheating stuttering during high-frequency operation
Miniaturized Integrated Packaging for Slim Body Adaptation

Adopts standard FBGA-153 ball grid array packaging with a compact size of 11.5mm×13mm and high integration.

  • Does not require complex additional peripheral circuits
  • Simplifies hardware design structure of terminal devices
  • Perfectly conforms to slim and miniaturized design trends
  • Saves internal device space while ensuring stable storage performance
  • Suitable for assembly of various portable civilian smart terminals
Factory Images
Why Choose China Chips Star Semiconductor?
  • Strong research and development capabilities
  • Advanced packaging and testing technology
  • Complete storage product production line
  • Operating our own PG brand focused on storage semiconductors
  • Multiple copyright patents
  • High cost-effectiveness and competitive pricing

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    260~300

  • Ecer Certification:

    Verified Supplier

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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Get in touch with us

  • Reach Us
  • China Chips Star Semiconductor Co., Ltd.
  • Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
  • https://www.emmcmemorycard.com/

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