China Chips Star Semiconductor Co., Ltd.
| Packeage Type | 153BGA |
| Working Temperature | -40°C~105°C |
| Supply Ability | 100K a month |
| Product | Emmc Ic |
| Read Speed | Up To 330MB/S |
| Packaging Details | Default packaging or customized packaging |
| Payment Terms | L/C,T/T |
| Oem | Welcome |
| Delivery Time | 3 to 15 days |
| Write Speed | Up to 240 MB/s |
| Use Case | smart cockpits and ADAS systems |
| Factory | Yes |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
| Certification | AEC-Q100 |
View Detail Information
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eMMC 5.1 Automotive Grade Operating Stably in the Range of -40℃~105℃ BGA 153
Product Specification
| Packeage Type | 153BGA | Working Temperature | -40°C~105°C |
| Supply Ability | 100K a month | Product | Emmc Ic |
| Read Speed | Up To 330MB/S | Packaging Details | Default packaging or customized packaging |
| Payment Terms | L/C,T/T | Oem | Welcome |
| Delivery Time | 3 to 15 days | Write Speed | Up to 240 MB/s |
| Use Case | smart cockpits and ADAS systems | Factory | Yes |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| Certification | AEC-Q100 | ||
| High Light | ic memory chip ，64gb emmc 5.1 ，128gb emmc flash memory | ||
Modern vehicles have evolved beyond simple transportation tools. Smart cockpits, ADAS platforms, digital clusters, HUDs, and telematics systems continuously process and store large amounts of data in increasingly demanding environments.
Automotive electronics face conditions far harsher than consumer devices:
In these challenging environments, storage devices become one of the most critical components affecting overall system stability and reliability.
PG brand embedded eMMC memory chips are designed specifically for automotive applications and can significantly improve system reliability and operational safety.
Unlike commercial-grade flash memory, AEC-Q100 automotive eMMC undergoes rigorous qualification testing to verify its reliability under harsh automotive conditions.
Key qualification areas include:
These comprehensive tests help ensure stable operation throughout the vehicle's entire service life, providing the reliability demanded by automotive applications.
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Capacities | 32GB, 64GB, 128GB, 256GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Temperature Range | -40°C~105°C |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Package | BGA (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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