China Chips Star Semiconductor Co., Ltd.
| Package Type | BGA (Ball Grid Array) |
| Custom | Support |
| Bus Width | 8-bit |
| Function | Memory |
| Supply Ability | 100K a month |
| Nand Flash Type | 3D NAND |
| Delivery Time | 10 to 15 days |
| Key Features | Good Quality, high performance |
| Payment Terms | L/C,T/T |
| Working Temperature | -25~85℃ |
| Compatibility | Smartphone |
| Voltage | 1.8V / 3.3V |
| Partitioning | Supports multiple partitions including RPMB, GP partitions |
| Model Number | G28128TLCB/G28256TLCB/G2864GTLCB |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
View Detail Information
Explore similar products
Factory Bulk EMMC5.1 64GB 128GB 256GB 512GB 32GB Memory Chip EMMC5.1 For Mobile
EMMC 5.1 Integrated Circuits Memory Chip MODULE EMMC 64GB 128GB 256GB In Stock
Emmc 64GB 128GB 256GB For PG Brand New And Original Memory IC Chip
EMMC 5.1 For Set-top Box 256GB 128GB 64GB IC Chips EMMC Integrated Circuit
Product Specification
| Package Type | BGA (Ball Grid Array) | Custom | Support |
| Bus Width | 8-bit | Function | Memory |
| Supply Ability | 100K a month | Nand Flash Type | 3D NAND |
| Delivery Time | 10 to 15 days | Key Features | Good Quality, high performance |
| Payment Terms | L/C,T/T | Working Temperature | -25~85℃ |
| Compatibility | Smartphone | Voltage | 1.8V / 3.3V |
| Partitioning | Supports multiple partitions including RPMB, GP partitions | Model Number | G28128TLCB/G28256TLCB/G2864GTLCB |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| High Light | IOT device embedded eMMC flash ，High reliability wide temp eMMC ，Embedded system original eMMC | ||
eMMC5.1 Mini Compact EMMC Flash IC Low Power Consumption For Mobile Portable Devices
Fully compliant with JEDEC industry standards and equipped with HS400 high-speed transmission mode, delivering a maximum sequential read speed of 230MB/s. It enables smooth system boot-up for smart TVs, tablets and OTT set-top boxes, and backward-compatible with legacy motherboards supporting eMMC 4.5 & 5.0 for direct hardware replacement without circuit modification.
Adopted mature 3D TLC flash particles with full capacity ranges from 8GB to 128GB. Optimized per-unit storage cost brings obvious advantages for bulk orders, perfectly matching mass production of mid-to-low-end consumer electronics while balancing performance and overall manufacturing expenditure.
Standard 11.5×13mm thin BGA footprint with minimal space occupation and stable SMD soldering performance. It fits slim tablets and portable casting devices with limited PCB layout space, free of mechanical components to withstand minor daily vibration.
Built-in algorithms including automatic wear leveling, real-time bad block detection and power-fail data retention. It lowers the risk of file corruption during system updates and video caching to extend the service life of embedded storage devices.
Compatible with Android tablets, smart TVs, OTT set-top boxes, home projectors and indoor surveillance cameras. It supports mainstream main controller solutions and allows pre-flashing of system firmware before delivery for direct SMD mounting on production lines.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
Get in touch with us
Leave a Message, we will call you back quickly!