| Flash | 3D TLC nand flash |
| Wafer | KIOXIA |
| Material | Plastic |
| Operating Temperature | -45~105℃ |
| Supply Ability | 100K a month |
| Packaging Details | Default packaging or customized packaging |
| Delivery Time | 3 to 15 days |
| Payment Terms | L/C,T/T |
| Endurance | Up to 3,000 Program/Erase cycles |
| Condition | Good Quality |
| Product name | Automotive Grade eMMC5.1 |
| Products Status | New |
| Size | 11.5x13x1.0/11.5x13x1.2 |
| Interface | HS400 (400MB/s) |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
View Detail Information
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Product Specification
| Flash | 3D TLC nand flash | Wafer | KIOXIA |
| Material | Plastic | Operating Temperature | -45~105℃ |
| Supply Ability | 100K a month | Packaging Details | Default packaging or customized packaging |
| Delivery Time | 3 to 15 days | Payment Terms | L/C,T/T |
| Endurance | Up to 3,000 Program/Erase cycles | Condition | Good Quality |
| Product name | Automotive Grade eMMC5.1 | Products Status | New |
| Size | 11.5x13x1.0/11.5x13x1.2 | Interface | HS400 (400MB/s) |
| Brand Name | PG | Place of Origin | Shenzhen, China |
Modern automotive radar systems continuously generate and process large volumes of sensing data to support object detection, distance measurement, and collision avoidance functions. China Chips Star Semiconductor Co., Ltd.'s Automotive Flash Memory eMMC 5.1 is specifically designed for automotive radar applications, providing reliable embedded storage for radar control units and advanced driver assistance systems (ADAS). With high endurance NAND technology and optimized firmware architecture, it ensures stable data logging, firmware execution, and system responsiveness in demanding driving environments.
Automotive radar modules operate under challenging temperature and vibration conditions. The Automotive Grade eMMC 5.1 supports a wide operating temperature range and complies with stringent automotive reliability requirements. Its robust embedded memory design helps maintain data integrity during rapid temperature fluctuations, vehicle vibrations, and long-term operation. This makes it an ideal storage solution for front radar, corner radar, surround radar, and next-generation autonomous driving platforms.
As automotive radar systems become more intelligent, storage performance directly impacts system startup speed and real-time data processing capability. The eMMC 5.1 interface delivers high-speed read and write performance, enabling faster firmware loading, radar algorithm updates, and sensor data management. Combined with PE3000 program/erase cycle endurance, it extends product lifespan and reduces maintenance costs. China Chips Star Semiconductor Co., Ltd. provides dependable automotive embedded memory solutions that help radar manufacturers achieve higher reliability, longer service life, and enhanced vehicle safety.
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Capacities | 32GB, 64GB, 128GB, 256GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Temperature Range | -40°C~105°C |
| PE | 3000 |
| Security | RPMB, secure boot, and write protection |
| Package | BGA (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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