China Chips Star Semiconductor Co., Ltd.
| Delivery Time | 10 to 15 days |
| Application | In-Vehicle Infotainment (IVI) |
| Package | BGA153 (11.5 x 13 mm) |
| Payment Terms | T/T,L/C |
| Supply Ability | 100K Pieces per Month |
| Operating Temperature | -40C to 105C |
| Product Name | HS400 Automotive eMMC 5.1 |
| NAND Flash | 3D TLC |
| Capacity | 64GB |
| Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Interface | eMMC 5.1 HS400 |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
| Model Number | G2864GTLCA |
| Certification | IATF 16949, AEC-Q100, RoHS, CE |
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Product Specification
| Delivery Time | 10 to 15 days | Application | In-Vehicle Infotainment (IVI) |
| Package | BGA153 (11.5 x 13 mm) | Payment Terms | T/T,L/C |
| Supply Ability | 100K Pieces per Month | Operating Temperature | -40C to 105C |
| Product Name | HS400 Automotive eMMC 5.1 | NAND Flash | 3D TLC |
| Capacity | 64GB | Packaging Details | Anti-static tray + vacuum sealed bag, export-grade carton |
| Interface | eMMC 5.1 HS400 | Brand Name | PG |
| Place of Origin | Shenzhen, China | Model Number | G2864GTLCA |
| Certification | IATF 16949, AEC-Q100, RoHS, CE | ||
| High Light | HS400 eMMC 5.1 Interface ，64GB IVI Embedded Storage ，Automotive BGA153 Flash Memory | ||
For In-Vehicle Infotainment (IVI), the G2864GTLCA supplies 64GB of automotive grade 3D TLC embedded flash in a compact BGA153 package.
A robust command queue and HS400 timing keep latency low during mixed read and write traffic. The HS400 high-speed interface delivers fast boot and responsive data access, cutting firmware load times in demanding in-vehicle systems.
At 64GB, capacity is matched to real automotive workloads, leaving margin for updates while the controller preserves data integrity from -40C to 105C.
Production follows a controlled semiconductor supply chain with lot-level traceability, and each unit is functionally tested across the full operating range. Qualification support includes datasheets, reliability reports, and application engineering so your integration proceeds with fewer surprises.
Automotive grade process discipline is applied from wafer sort through packaging and final electrical test.
| Model | Capacity | Protocol | NAND | Package | Dimensions | Operating Temp. | Storage Temp. |
|---|---|---|---|---|---|---|---|
| G2832TLCA | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5 x 13 mm | -40C to 105C | -50C to 125C |
| G2864GTLCA | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5 x 13 mm | -40C to 105C | -50C to 125C |
| G28128TLCA | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5 x 13 mm | -40C to 105C | -50C to 125C |
| Parameter | Value |
|---|---|
| Brand | PG |
| Model Number | G2864GTLCA |
| Capacity | 64GB |
| Interface | eMMC 5.1 HS400 |
| Package | BGA153 (11.5 x 13 x 1.0 mm) |
| NAND Flash | 3D TLC with LDPC ECC |
| Operating Temperature | -40C to 105C |
| Storage Temperature | -50C to 125C |
| Supply Voltage | 3.3V VCC / 1.8V VCCQ |
| Sequential Read | Up to 330 MB/s |
| Sequential Write | Up to 240 MB/s |
| Certification | IATF 16949, AEC-Q100 |
| Primary Application | In-Vehicle Infotainment (IVI) |
Across these modules, the device keeps firmware, maps, and logs safe and quickly accessible.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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