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China Chips Star Semiconductor Co., Ltd.

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China Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
China Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

  1. China Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
  2. China Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
  3. China Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
  4. China Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

  1. MOQ: 50pcs
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms L/C,T/T
Supply Ability 100K a month
Delivery Time 10 to 15 days
Product name Automotive Embedded Multi Media Card
Logo Customized Service Available
Material Plastic
Capacity Options 64GB, 128GB, 256GB
Origin China
Package BGA153 Package
Quality Good
Read Speed 330MB/s
Brand Name PG
Place of Origin Shenzhen, China
Model Number G2864TLCA/ G28128TLCA/ G28256TLCA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C,T/T Supply Ability 100K a month
Delivery Time 10 to 15 days Product name Automotive Embedded Multi Media Card
Logo Customized Service Available Material Plastic
Capacity Options 64GB, 128GB, 256GB Origin China
Package BGA153 Package Quality Good
Read Speed 330MB/s Brand Name PG
Place of Origin Shenzhen, China Model Number G2864TLCA/ G28128TLCA/ G28256TLCA
High Light Embedded Multi Media CardBGA 153 Flash eMMCIC Component eMMC 5.1
Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
Automotive-grade eMMC is an embedded non-volatile memory chip specifically engineered for the demanding environments of automotive electronics. Utilizing the BGA 153 package, this solution integrates NAND flash, controller, and MMC interface into a single chip, fully compliant with automotive standards including AEC-Q100. With core advantages of high reliability, wide temperature resistance, extended durability, and robust protection, it serves as a critical storage solution for multiple applications in intelligent vehicles.
Technical Specifications
Interface eMMC 5.1 with HS400 support
Capacities 64GB, 128GB, 256GB
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range -40°C to 105°C
Endurance High endurance for frequent read/write cycles
Security RPMB, secure boot, and write protection
Package BGA (Ball Grid Array)
Package Size 11.5 x 13 x 1 mm
Core Technologies and Reliability Design
Automotive Certification and Wide Temperature Adaptation
Complies with AEC-Q100 Grade2 (-40℃~105℃) and adapts to temperature variations across automotive environments including engine compartments and cockpits. Certified with IATF16949 quality management standards.
Performance and Power Consumption Optimization
Adheres to JEDEC eMMC 5.1 protocol with HS400 high-speed mode support, delivering sequential read/write speeds up to 330/240MB/s. Features intelligent low-power algorithms and FBA acceleration technology to balance high performance with efficient power consumption.
Packaging and Adaptability
Utilizes 153-ball FBGA package (11.5*13*1mm dimensions). The on-board soldering method enhances vibration resistance, enabling adaptation to the limited space and impact resistance requirements of automotive electronics. Available in capacities ranging from 64GB to 256GB.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    260~300

  • Ecer Certification:

    Verified Supplier

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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  • China Chips Star Semiconductor Co., Ltd.
  • Room 401-404, Unit 1, Building B, Building 8, Huaqiang Creative Industrial Park, Biyan Community, Guangming Street, Guangming Dist.
  • https://www.emmcmemorycard.com/

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