256GB EMMC5.1 32GB Anti-Interference EMMC Specialized For Industrial Automation

MOQ： 50pcs
Price： Negotiable
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Payment Terms	L/C,T/T
Supply Ability	100K a month
Delivery Time	3 to 15 days
Compatible	Digital Photo Frames
Package Type	BGA (Ball Grid Array)
Storage Capacity	64GB/128GB/256GB
Compatibility	POS machine motherboards
Standard	eMMC 5.1
Quality	New
Choice Of Flash	MLC/3DTLC/QLC NAND
Brand Name	PG
Place of Origin	Shenzhen, China
Model Number	G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB

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Product Details
Company Details

Product Specification


Payment Terms	L/C,T/T	Supply Ability	100K a month
Delivery Time	3 to 15 days	Compatible	Digital Photo Frames
Package Type	BGA (Ball Grid Array)	Storage Capacity	64GB/128GB/256GB
Compatibility	POS machine motherboards	Standard	eMMC 5.1
Quality	New	Choice Of Flash	MLC/3DTLC/QLC NAND
Brand Name	PG	Place of Origin	Shenzhen, China
Model Number	G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB
High Light	EMMC5.1 32GB ，EMMC 64gb ，embedded ic

256GB eMMC 5.1 for Industrial Automation Equipment

High-performance 256GB eMMC 5.1 storage solution specifically engineered for industrial automation applications requiring 24/7 uninterrupted read/write operations with enhanced anti-interference capabilities.

Product Specifications

Model	G2864GTLCB	G28128TLCB	G28256TLCB
NAND Flash	3D TLC NAND	3D TLC NAND	3D TLC NAND
Capacity	64GB	128GB	256GB
CE	1	2	4
Read Speed	up to 330MB/s	up to 330MB/s	up to 330MB/s
Write Speed	up to 240MB/s	up to 240MB/s	up to 240MB/s
Operating Temperature	-25℃~85℃	-25℃~85℃	-25℃~85℃
EP	≥3000	≥3000	≥3000
Packaging Specification	BGA 153	BGA 153	BGA 153
Size	11.5mm13mm1.0mm	11.5mm13mm1.0mm	11.5mm13mm1.2mm

Connection Bridge: Packaging Substrate and Interface

The packaging substrate serves as the physical carrier of the eMMC module, providing mechanical support and electrical connectivity between the MMC controller and NAND flash memory chip. The interface functions as the communication bridge between eMMC and the host system, adhering to JEDEC standardized interface specifications.

Key Interface Features

Parallel bus architecture with comprehensive pin configuration
Power supply pins (VCC, VCCQ) for stable operation
Data pins (D0-D7) supporting 8-bit data transfer
Clock pin (CLK) and command pin (CMD) for synchronization
8-bit data bus enables double the data transmission rate compared to 4-bit bus at identical clock frequencies

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory

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Business Type:

Manufacturer,Seller 
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Year Established:

2019 


Employee Number:

260~300 


Ecer Certification：

Verified Supplier 

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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China Chips Star Semiconductor Co., Ltd.
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
https://www.emmcmemorycard.com/

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