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{"title":"Original New Intergrated Circuit Ic Chip Automotive Embedded EMMC 5.1 BGA153ball","imgUrl":"https:\/\/img.chinax.com\/nimg\/76\/14\/99842397f8889a9e84ad87f12e99-200x200-1\/original_new_intergrated_circuit_ic_chip_automotive_embedded_emmc_5_1_bga153ball.jpg","attrs":{"Price":"Negotiable","Payment Terms":"L\/C,T\/T","Supply Ability":"100K a month","Delivery Time":"10 to 15 days"}}
{"title":"Automotive Grade eMMC5.1 BGA153 Package Memory IC HS400 for ADAS 64GB 128GB","imgUrl":"https:\/\/img.chinax.com\/nimg\/bb\/53\/e9ec7f96a8c0e2bfa829d3642e84-200x200-1\/automotive_grade_emmc5_1_bga153_package_memory_ic_hs400_for_adas_64gb_128gb_256gb.jpg","attrs":{"Interface":"HS400, HS200, HS, DDR","Operating Temperature":"-45\u00b0C To +105\u00b0C","Minimum Order Quantity":"50pcs","Color":"Black"}}
{"title":"Automotive Grade EMMC5.1 64GB 128GB 256GB 512GB High Write And Data Stability","imgUrl":"https:\/\/img.chinax.com\/nimg\/b9\/82\/6729ece824a7a48aa4fea7d4ccb2-200x200-1\/automotive_grade_emmc5_1_64gb_128gb_256gb_512gb_high_write_and_data_stability.jpg","attrs":{"Product name":"Automotive Grade EMMC5.1","Operating temperature":"-40\u2103~+85\u2103\/-45\u2103~+105\u2103","Capacity":"64GB-256GB","Agreement":"HS400"}}
Original new integrated circuit IC chip featuring Automotive Embedded eMMC 5.1 technology with BGA153 ball package. Available in 64GB, 128GB, and 256GB storage capacities, specifically engineered for demanding automotive electronic applications.
Automotive Embedded eMMC is an embedded storage chip designed to withstand the harsh operating conditions of automotive electronics. Adhering to the core eMMC 5.1 standard with BGA153 package, it offers exceptional temperature tolerance, vibration resistance, high reliability, and data security. Ideal for critical in-vehicle applications including intelligent cockpits, ADAS, and in-vehicle infotainment (IVI) systems.
Technical Specifications
Interface
eMMC 5.1 with HS400 support
Capacities
64GB, 128GB, 256GB
Data Transfer Speed
Up to 400MB/s (HS400 mode)
Operating Voltage
3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range
-40°C to 105°C
Endurance
High endurance for frequent read/write cycles
Security
RPMB, secure boot, and write protection
Package
BGA (Ball Grid Array)
Package Size
11.5 x 13 x 1 mm
Application Scenarios
Intelligent Cockpit / IVI: Stores multimedia content, navigation maps, and system firmware
ADAS / Autonomous Driving: Records sensor data and runs algorithm models
In-vehicle Central Control / Instrument Cluster: Stores system programs and real-time vehicle status data
Why Choose Our Automotive eMMC Solutions?
Strong research and development capabilities
Advanced packaging and testing technology
Complete storage product production line
Operating our own brand PG focused on storage semiconductor field
Multiple copyright patents
High cost-effectiveness and competitive pricing
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
