| Payment Terms | L/C,T/T |
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Reliability Features | Enhanced data reliability with improved ECC and wear leveling |
| Condition | New |
| Logo | OEM |
| Choice Of Flash | MLC / 3D TLC / QLC NAND |
| Interface | MMC (MultiMediaCard) interface |
| Dimensions | 11.5mm x 13mm x 1.0mm |
| Trim/Erase | Supports Trim and secure erase commands |
| Bus Speed | HS400 (up to 400MB/s) |
| Quality | 100% original |
| Warranty | 1 year |
| Nand Flash | TLC |
| Status | Good health |
| Boot Operation | Supports boot partitions with secure boot features |
| Operating Voltage | 2.7V - 3.6V |
| Write Speed | 240MB/s |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
| Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
View Detail Information
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Product Specification
| Payment Terms | L/C,T/T | Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days | Reliability Features | Enhanced data reliability with improved ECC and wear leveling |
| Condition | New | Logo | OEM |
| Choice Of Flash | MLC / 3D TLC / QLC NAND | Interface | MMC (MultiMediaCard) interface |
| Dimensions | 11.5mm x 13mm x 1.0mm | Trim/Erase | Supports Trim and secure erase commands |
| Bus Speed | HS400 (up to 400MB/s) | Quality | 100% original |
| Warranty | 1 year | Nand Flash | TLC |
| Status | Good health | Boot Operation | Supports boot partitions with secure boot features |
| Operating Voltage | 2.7V - 3.6V | Write Speed | 240MB/s |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB | ||
| High Light | 3D TLC EMMC ,256GB EMMC Chip ,EMMC Chip 64GB BGA153 | ||
| Model | G2564GTLIA | G25128TLIA | G25256TLIA | G25512TLIA |
|---|---|---|---|---|
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥7000 | ≥7000 | ≥7000 | ≥7000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm*13mm*1.0mm | 11.5mm*13mm*1.0mm | 11.5mm*13mm*1.2mm | 11.5mm*13mm*1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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