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China Chips Star Semiconductor Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits
China New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits

  1. China New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits
  2. China New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits

New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits

  1. MOQ: 50pcs
  2. Price: Negotiable
  3. Get Latest Price
Payment Terms L/C,T/T
Supply Ability 100K a month
Delivery Time 10 to 15 days
Product name EMMC 5.1 Flash Memory
Operating Temperature -25°C to 85°C
Choice Of Flash MLC / 3D TLC / QLC NAND
Capacity Up to 256GB
Read Speed Up To 330MB/S
Oem Welcome
Wafer KIOXIA
Warranty 1 Years
Brand Name PG
Place of Origin Shenzhen, China
Model Number G2864TLCB/G28128TLCB/G28256TLCB

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C,T/T Supply Ability 100K a month
Delivery Time 10 to 15 days Product name EMMC 5.1 Flash Memory
Operating Temperature -25°C to 85°C Choice Of Flash MLC / 3D TLC / QLC NAND
Capacity Up to 256GB Read Speed Up To 330MB/S
Oem Welcome Wafer KIOXIA
Warranty 1 Years Brand Name PG
Place of Origin Shenzhen, China Model Number G2864TLCB/G28128TLCB/G28256TLCB
High Light New Original emmcemmc BGA153Flash Memory emmc 5.1
BGA153 eMMC 5.1 Flash Memory IC Chips
New Original 64GB, 128GB, and 256GB BGA153 eMMC 5.1 Flash Memory Integrated Circuits - essential electronic components for smart speaker applications and embedded systems.
eMMC (Embedded Multimedia Card) delivers high integration, exceptional stability, reliability, and cost-effective performance, making it a core storage component in smart speaker hardware solutions. These chips handle critical functions including firmware storage, data caching, and operational support.
Technical Specifications
Model G2864TLCB/G28128TLCB/G28256TLCB
Capacity 64GB / 128GB / 256GB
Working Temp -25°C to 85°C
Wafer KIOXIA
Package Type BGA153
Read Speed 330 MB/s
Write Speed 240 MB/s
Competitive Advantages for Smart Speaker Applications
Customized Capacity Solutions
Multiple capacity options from 64GB to 256GB to meet diverse smart speaker price points and performance requirements.
Optimized Power Efficiency
Advanced controller algorithms minimize standby power consumption, enhancing device stability when integrated with smart speaker power management systems.
Broad Platform Compatibility
Compatible with mainstream chip platforms including MediaTek, Rockchip, Quanzhi, and other common smart speaker processors. Comprehensive driver support accelerates product development cycles.
Core Requirements for Smart Speaker eMMC
  • Low Power Adaptation: Supports sleep and power-saving modes to minimize energy consumption during standby, maintaining wake-up functionality while reducing overall power usage.
  • Stable Read/Write Performance: Fast sequential read/write speeds ensure quick firmware loading and large file processing. Random read/write capabilities enable rapid voice command parsing and response.
  • High Reliability & Durability: Engineered for continuous 24/7 operation, capable of withstanding prolonged high-frequency read/write cycles from logging, updates, and system operations.
  • Compact Size & High Integration: BGA packaging integrates flash memory and controllers into a single chip, eliminating additional control circuits and optimizing PCB space for compact smart speaker designs.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    260~300

  • Ecer Certification:

    Verified Supplier

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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  • China Chips Star Semiconductor Co., Ltd.
  • Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
  • https://www.emmcmemorycard.com/

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