China Chips Star Semiconductor Co., Ltd.
| Read speed | Up to 330MB/s |
| Capacity | 64GB-256GB |
| Write speed | Up to 240MB/s |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Operating temperature | 0℃~70℃ |
| Package Type | BGA153 |
| Product name | EMMC IC Memory Chip |
| Agreement | HS400 |
| Payment Terms | L/C,T/T |
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
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Product Specification
| Read speed | Up to 330MB/s | Capacity | 64GB-256GB |
| Write speed | Up to 240MB/s | Choice of Flash | MLC/3DTLC/QLC NAND |
| Operating temperature | 0℃~70℃ | Package Type | BGA153 |
| Product name | EMMC IC Memory Chip | Agreement | HS400 |
| Payment Terms | L/C,T/T | Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days | Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| High Light | BGA153 EMMC5.1 ，EMMC5.1 64GB ，EMMC IC Memory Chip | ||
The Gemini series eMMC5.1 is based on high-performance controller LDPC technology, Samsung and KIOXIA BiCS5 3DTLC/YMTC QLC NAND Flash for multi-layer stacking, complying with the HS400 standard. It meets customers' demanding requirements for large capacity, high performance, low power consumption, compatibility, and stability of eMMC in complex and diverse applications.
| Model | G2564GTLCB | G25128TLCB | G25256TLCB | G25512TLCB |
|---|---|---|---|---|
| NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating temperature | 0℃~70℃ | 0℃~70℃ | 0℃~70℃ | 0℃~70℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
The pin definition of the eMMC chip is slightly different from that of a general SIM card or SD card, and needs to be modified appropriately according to the specific hardware device and chip specifications.
Power supply and interface: Ensure a stable power supply and ground cable for the eMMC chip.
Layout and routing: The length of the signal line should be matched as far as possible to reduce the delay and distortion of signal transmission.
Because of its compact design and high performance, eMMC chips have become the most popular storage units in mobile devices.
By integrating controllers and using advanced communication protocols, eMMC chips provide data security and reliability.
In short, eMMC chips play a crucial role in modern mobile devices due to their high efficiency, reliability and easy integration.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification：
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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