| Agreement | HS400 |
| Payment Terms | L/C,T/T |
| Supply Ability | 100K a month |
| Delivery Time | 10 to 15 days |
| Operating temperature | -40℃~+85℃/-45℃~+105℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Read speed | Up to 330MB/s |
| Write speed | Up to 240MB/s |
| Capacity | 64GB |
| Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
| Brand Name | PG |
| Place of Origin | Shenzhen, China |
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Product Specification
| Agreement | HS400 | Payment Terms | L/C,T/T |
| Supply Ability | 100K a month | Delivery Time | 10 to 15 days |
| Operating temperature | -40℃~+85℃/-45℃~+105℃ | Choice of Flash | MLC/3DTLC/QLC NAND |
| Read speed | Up to 330MB/s | Write speed | Up to 240MB/s |
| Capacity | 64GB | Model Number | G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB |
| Brand Name | PG | Place of Origin | Shenzhen, China |
| High Light | EMMC 5.1 32GB ,EMMC 5.1 16GB ,256GB Memory IC Chips | ||
Industrial Grade eMMC 5.1 Memory IC Chips - Available in 16GB, 32GB, 64GB, 128GB, and 256GB capacities with spot inventory for fast delivery.
The Libra series industrial grade eMMC 5.1 is a high-performance embedded storage solution carefully designed to meet extremely demanding industrial application requirements. Utilizing independently developed controllers and Kioxia industrial grade wafers, these chips deliver unparalleled performance and reliability in extreme temperatures, high-vibration environments, and applications requiring long-term stable operation.
| Model | G2564GTLIA | G25128TLIA | G25256TLIA | G25512TLIA |
|---|---|---|---|---|
| NAND Flash | 3D TLC NAND | 3D TLC NAND | 3D TLC NAND | 3D TLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.2mm | 11.5mm×13mm×1.2mm |
The Internet of Everything represents the general trend, and products within related application scenarios are becoming the most important market for memory solutions. For these applications, the combination of large capacity requirements and ease of development makes eMMC the storage solution of choice.
While UFS flash memory has largely replaced eMMC in high-end mobile devices due to its superior development potential, eMMC flash memory continues to thrive in numerous industrial and embedded applications including:
eMMC's key advantage lies in its integrated design combining NAND Flash with a master IC controller. This provides a standard interface and manages flash memory operations, allowing product manufacturers to focus on other development aspects and significantly reduce time to market. These features remain equally important for NAND suppliers seeking to reduce lithography size and manufacturing costs.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Employee Number:
260~300
Ecer Certification:
Verified Supplier
Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...
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