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China Chips Star Semiconductor Co., Ltd.

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China eMMC Embedded Memory IC HS400 Extend Battery Life in Your Devices for Automotive
China eMMC Embedded Memory IC HS400 Extend Battery Life in Your Devices for Automotive

  1. China eMMC Embedded Memory IC HS400 Extend Battery Life in Your Devices for Automotive

eMMC Embedded Memory IC HS400 Extend Battery Life in Your Devices for Automotive

  1. MOQ: 50pcs
  2. Price:
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Operating Temperature -25°C To +85°C
Nand Flash MLC/TLC/QLC
Color Black
Interface HS400, HS200, HS, DDR
Random Write Speed Up To 10,000 IOPS
Protocol HS400
Condition New
Manufacturer PG
Brand Name PG
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Operating Temperature -25°C To +85°C Nand Flash MLC/TLC/QLC
Color Black Interface HS400, HS200, HS, DDR
Random Write Speed Up To 10,000 IOPS Protocol HS400
Condition New Manufacturer PG
Brand Name PG Place of Origin China
High Light HS400 eMMC Embedded Memory ICAutomotive eMMC Embedded Memory IC

    eMMC 5.1 Embedded Memory IC– High-Performance Storage for Next-Generation Devices

 

Overview

The eMMC 5.1 embedded memory solution delivers exceptional performance, reliability, and scalability for a wide range of applications. Designed to meet the demands of modern devices, it combines high-speed data transfer, robust endurance, and compact form factors, making it the ideal choice for smartphones, tablets, IoT devices, automotive systems, and industrial applications.

 

Key Features

Blazing Fast Speeds with HS400 Interface

​Supports the eMMC 5.1 standard with HS400 mode for data transfer speeds of up to 400MB/s.

Enhances overall system performance, ensuring smooth multitasking and faster boot times.

High-Capacity Options

Available in a range of capacities from 16GB to 256GB, catering to diverse storage needs.

Scalable storage for apps, media, and operating systems.

Enhanced Reliability and Endurance

Built with advanced NAND flash technology for superior durability and long-term performance.

Supports wear leveling, bad block management, and error correction to ensure data integrity.

Low Power Consumption

Optimized power efficiency extends battery life in portable devices.

Ideal for energy-sensitive applications like IoT and mobile devices.

Compact and Integrated Design

Combines flash memory and a controller in a single BGA package, reducing design complexity and saving PCB space.

Compact form factor ideal for space-constrained devices.

Wide Operating Temperature Range

Supports industrial-grade temperature ranges (-25°C to 85°C or extended options for automotive applications).

Ensures reliable operation in harsh environments.

Advanced Security Features

Built-in security features such as RPMB (Replay Protected Memory Block) for secure data storage and authentication.

Protects sensitive data from unauthorized access.

 

Applications

Mobile Devices: Smartphones, tablets, and wearables.

Automotive: Infotainment systems, ADAS, and telematics.

IoT: Smart home devices, industrial sensors, and connected appliances.

Industrial: Robotics, automation, and embedded systems.

Consumer Electronics: Digital cameras, gaming consoles, and set-top boxes.

 

Technical Specifications

Parameter Details
Interface eMMC 5.1 with HS400 support
Capacities 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range -25°C to 85°C  (industrial-grade options available -40°C~85°C/105°C)
Endurance High endurance for frequent read/write cycles
Security RPMB, secure boot, and write protection
Package BGA (Ball Grid Array)
Package Size 11.5 x 13 x 1 mm

 

 

Why Choose eMMC 5.1?

 

Cost-Effective: Combines NAND flash and a controller in a single package, reducing BOM costs.

Ease of Integration: Simplifies design and development with a standardized interface.

Future-Proof: Supports the latest eMMC standards for compatibility with next-generation devices.

 

 

Support and Resources

 

Datasheets: Download detailed technical specifications.

Design Guides: Access integration guidelines and best practices.

Technical Support: Contact our team for assistance with your design.

 

 

Contact Us

Ready to integrate eMMC 5.1 into your next project? Reach out to our sales team for pricing, samples, and custom solutions.

 
This description can be tailored further based on specific product details or branding requirements. Let me know if you need additional adjustments!

Company Details

Bronze Gleitlager

,

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Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Employee Number:

    100~120

  • Ecer Certification:

    Verified Supplier

Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc... Founded in 2019, China Chips Star Semiconductor Co., Ltd. is headquartered in Shenzhen and has branches in Hong Kong, Nanjing, and Singapore. It is a National High-Tech Enterprise and a Specialized and Sophisticated Small and Medium-sized Enterprise, focusing on the research and development, produc...

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Get in touch with us

  • Reach Us
  • China Chips Star Semiconductor Co., Ltd.
  • Room 401-404, Unit 1, Building B, Building 8, Huaqiang Creative Industrial Park, Biyan Community, Guangming Street, Guangming Dist.
  • https://www.emmcmemorycard.com/

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