Products
Manufacturer of a wide range of products which include TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding |,DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond,E1-TH862TD 0....
MOQ:
Price:
| Color | white translucent |
| Total Thickness | 0.153±0.005mm |
| Model Number | TS650RN |
| Brand Name | KHJ |
| Certification | ROHS |
| Place of Origin | ShenZhen China |
MOQ:
Price:
| Model Number | DTS640A |
| Brand Name | KHJ |
| Certification | ROHS、ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price: Negotiable
| Backing Thickness | 0.025mm |
| Supply Ability | 10000 M2/Day |
| Delivery Time | 1 Week |
| Packaging Details | Poly Bag+ Carton |
| Product Name | E1-TH862TD |
| Tensile Strength at Break | ≥4(KN/M) |
| Elongation at Break: | ≥90% |
| Total Tape Thickness | 0.06±0.005mm |
| Adhesion to Steel | 5~7N/25mm |
| Payment Terms | L/C, T/T |
| Brand Name | KHJ |
| Model Number | E1-TH862TD |
| Certification | CE、ROHS、ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price: Negotiable
| Total Tape Thickness | 0.025mm |
| product name | E2-FA926S |
| Elongation at Break: | ≥70% |
| Tensile Strength at Break: | ≥4(KN/M) |
| Surface Resistance | 105~10ohms |
| Adhesion to Steel | 10N/25mm |
| Supply Ability | 10000 M2/Day |
| Delivery Time | 1 Week |
| Packaging Details | Poly Bag+ Carton |
| Brand Name | KHJ |
| Model Number | E2-FA926S |
| Certification | CE、ROHS、ISO9001 |
| Place of Origin | China |
MOQ: 1pcs
Price: Negotiable
| Backing thickness (μm) | 25±3 |
| Product Name | E2-B82IB |
| Payment Terms | L/C, T/T |
| Supply Ability | 10000 square meters/day |
| Delivery Time | 3~5days after payment done |
| Packaging Details | Plastic bag + carton |
| Color Inside | Glossy black |
| Upmost Temperature | 260℃ |
| Thermal Conductivity(w/mk) | 0.2±0.05 |
| Color Surface | Matt black |
| Brand Name | KHJ |
| Model Number | E2-B82IB |
| Certification | RoHS |
| Place of Origin | Guangdong, China |
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