| Model Number | DTS641A |
| Brand Name | KHJ |
| Certification | ROHS、ISO9001 |
| Place of Origin | China |
View Detail Information
Explore similar products
Thermal Release Tape TS600D – Temporary Bonding Film for Semiconductor Wafer
TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat
TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding |
DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond
Product Specification
| Model Number | DTS641A | Brand Name | KHJ |
| Certification | ROHS、ISO9001 | Place of Origin | China |
| Test items | Measurement standards | Test Methods | ||
| Product thickness (except release film) (μm) | 200±10 | micrometer | ||
| Substrate thickness (μm) | 100±3 | micrometer | ||
| Foam rubber layer A thickness (μm) | 50±4 | micrometer | ||
|
180°Peel force (gf/25mm) |
Before thermal debonding | 700±150 | GBT 2792-2014 | |
| After heating and debonding | <5 | GBT 2792-2014 | ||
| Foam rubber layer B thickness (μm) | 50±4 | micrometer | ||
|
180°Peel force (gf/25mm) |
Before thermal debonding | 700±150 | GBT 2792-2014 | |
| After heating and debonding | <5 | GBT 2792-2014 | ||
Company Details
Business Type:
Manufacturer,Trading Company,Seller
Year Established:
1999
Total Annual:
1800000-20000000
Employee Number:
200~300
Ecer Certification:
Site Member
Shenzhen KHJ Technology Co., Ltd was established in 1999 engaged in R&D, manufacturing and marketing of ESD adhesive products, with years experience in this field, KHJ has achieved a number of patents & core technology, we offer customized adhesive solution to meet customer's special req... Shenzhen KHJ Technology Co., Ltd was established in 1999 engaged in R&D, manufacturing and marketing of ESD adhesive products, with years experience in this field, KHJ has achieved a number of patents & core technology, we offer customized adhesive solution to meet customer's special req...
Get in touch with us
Leave a Message, we will call you back quickly!