China factories

China factory - Shenzhen KHJ Technology Co., Ltd

Shenzhen KHJ Technology Co., Ltd

  • China,Shenzhen
  • Site Member

Leave a Message

we will call you back quickly!

Submit Requirement
China DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing
China DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing

  1. China DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing

DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing

  1. MOQ:
  2. Price:
  3. Get Latest Price
Model Number DTS641A
Brand Name KHJ
Certification ROHS、ISO9001
Place of Origin China

View Detail Information

Contact Now Ask for best deal
Get Latest Price Request a quote
  1. Product Details
  2. Company Details

Product Specification

Model Number DTS641A Brand Name KHJ
Certification ROHS、ISO9001 Place of Origin China
Product Description
 
DTS641A is a double-sided tape with good initial tack. Both sides are covered with foam rubber layers. Under the condition of 110-140 ℃, the viscosity of the foam rubber surface gradually disappears, and it can automatically separate from the adhered objec.
 
Product structure
 
DTS641A
Product features
 
Excellent weather resistance, no re-adhesion Strong instantaneous viscosity, components are easy to remove after thermal viscosity reduction without residual adhesive Comply with ROHS requirements
 
 
Product application
 
This product is suitable for temporary fixing of various types of components, ceramics, glass, metal plates, etc., and special cutting protection for various electronic industries.
 
 
Performance parameters

 

 

Test items Measurement standards Test Methods
Product thickness (except release film) (μm) 200±10 micrometer
Substrate thickness (μm) 100±3 micrometer
Foam rubber layer A thickness (μm) 50±4 micrometer

180°Peel force

(gf/25mm)

Before thermal debonding 700±150 GBT 2792-2014
After heating and debonding <5 GBT 2792-2014
Foam rubber layer B thickness (μm) 50±4 micrometer

180°Peel force

(gf/25mm)

Before thermal debonding 700±150 GBT 2792-2014
After heating and debonding <5 GBT 2792-2014

 

 

◎ Recommended debonding process: 120-135℃*3-10min (based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)
 
Storage method
Storage conditions: 10-30 , relative humidity
40-60% Storage period: 6 months
 
Things to note
The product should be kept away from heat and fire sources;
The surface of the object to be attached should be clean, dry, and free of oil or other contamination;
The product cannot be used outdoors to avoid residual adhesive remaining on the o
bject when the tape is removed due to the influence of outdoor weather.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company,Seller

  • Year Established:

    1999

  • Total Annual:

    1800000-20000000

  • Employee Number:

    200~300

  • Ecer Certification:

    Site Member

Shenzhen KHJ Technology Co., Ltd was established in 1999 engaged in R&D, manufacturing and marketing of ESD adhesive products, with years experience in this field, KHJ has achieved a number of patents & core technology, we offer customized adhesive solution to meet customer's special req... Shenzhen KHJ Technology Co., Ltd was established in 1999 engaged in R&D, manufacturing and marketing of ESD adhesive products, with years experience in this field, KHJ has achieved a number of patents & core technology, we offer customized adhesive solution to meet customer's special req...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen KHJ Technology Co., Ltd
  • KHJ Industrial park, Building 1,Chuangxin Industrial park, Xintian community, Guanlan, Longhua new district, Shenzhen,China 518110
  • https://www.khj.com.cn/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement