SMD 2.0mm Connector Female Header Dual Row Bottom Entry Gold Plated Pin Female

Product Specification

SMD 2.0mm Connector Female Header Dual Row Bottom Entry Gold Plated Pin Female Header

Highlight

• Bottom‑entry SMT dual‑row design saves top‑side PCB space, ideal for compact stacked‑board layout
• 2.0 mm pitch, balances footprint reduction and mechanical robustness vs 2.54 mm standard
• Gold‑plated contact pins: low contact resistance, anti‑oxidation, stable signal transmission for long‑term operation
• High‑temperature PA6T housing UL94V‑0, supports reflow soldering, tape‑reel packaging for auto‑assembly lines
• Wide pin‑count customization: 2×2 up to 2×40 positions, OEM pin height & plating thickness available
• RoHS / REACH compliant, meets global industrial electronics requirements

Product Description

General Mechanical Parameters

Material & Electrical Characteristics

Environment & Soldering Guide

Product Features

1. Bottom‑entry gull‑wing SMT terminals; no pin exposure on top of insulator, avoids component interference on PCB top layer
2. Dual‑row layout, 2.0 mm pitch, configurable pin counts from 2×2 to 2×40 positions
3. Contact: brass alloy base with gold‑over‑nickel plating; customizable gold thickness (3 μin ~ 30 μin)
4. Housing: high‑temp PA6T thermoplastic, UL94V‑0 flame retardant, black color, resistant to reflow thermal shock
5. Tape‑and‑reel packing standard; tube packing optional for prototype & small‑batch production
6. Strict dimensional consistency; stable mating force, reduces intermittent connection risk after repeated plug‑in cycles

Product Advantage

1. Bottom‑entry SMT unique value: No pins sticking out above housing. Designers can place height‑sensitive components directly above the connector area, greatly improving compact stacked‑PCB layout flexibility compared to vertical top‑entry SMD headers
2. Gold‑plated contacts prevent oxidation; performs reliably under humid industrial environments, lowering the field failure rate for signal circuits.
3. PA6T high‑temperature housing eliminates melting/deformation risk during lead‑free reflow, compatible with standard SMT production lines, no special process adjustment needed.
4. Wide pin‑count range + customizable plating thickness, supports prototype R&D and mass‑volume OEM projects.
5. Stable mating force: neither too loose to cause poor contact nor too tight to bring assembly difficulty.
6. Strict outgoing dimensional inspection, consistent footprint; easy footprint library creation for your PCB design.

Application

• Industrial control boards & IoT gateway modules
• Embedded computing, single‑board auxiliary interconnection
• Smart home hardware, sensor modules
• Medical auxiliary electronic equipment
• Network peripheral hardware
• Automobile interior non‑safety electronic assemblies
• Consumer electronics, display peripheral modules

Customization Options

1. Confirm pin count: choose dual‑row positions (2×N) according to your signal/power channel quantity.
2. Mounting direction: pick this bottom‑entry SMD when you need zero pin protrusion on PCB top side; do not select if you need through‑hole soldering.
3. Plating requirement:
   • Signal / indoor consumer device: gold flash (3 μin ~6 μin) for cost balance
   • High‑humidity industrial environment: select higher gold thickness ≥10 μin
4. Reflow condition: follow our soldering profile; do not exceed peak temperature 245 ℃.
5. Mating partner: must match standard 2.0 mm pitch male pin header; verify mechanical mating height before mass‑order.
6. Packaging: select tape‑reel for automatic SMT; tube for lab prototyping.