DIP Female Header 2.54 mm Pitch Double Row Female Straight Header Socket Pin

Product Specification

DIP Female Header 2.54 mm Pitch Double Row Female Straight Header Socket Pin Strip Connector

Highlight

• Industry‑standard 2.54 mm (0.100") pitch double‑row DIP through‑hole female header, full interoperability with standard 2.54 mm male pin headers
• Phosphor‑bronze contact terminals, optional gold/tin plating, stable contact under vibration & frequent mating
• UL94‑V0 high‑temperature PBT housing, compatible with wave‑soldering & manual rework processes
• Wide pin‑count range 2×2P‑2×40P, custom pin‑tail / insulator height available for OEM projects
• RoHS & REACH compliant, cost‑effective board‑to‑board stacking & prototyping interconnect solution

Product Description

General Mechanical Parameters

Material & Electrical Characteristics

Environment & Soldering Guide

Product Features

1. Double‑row straight vertical DIP through‑hole mounting, robust PCB mechanical anchoring against shock & vibration
2. Standard 2.54 mm pitch, fully compatible with mainstream 2.54 mm male header footprints and off‑the‑shelf components
3. Phosphor‑bronze spring contacts maintain consistent contact force over mating cycles, resist contact loosening
4. Black PBT insulator UL94‑V0 flame retardant, withstands wave‑soldering thermal stress without deformation
5. Flexible plating options: tin‑plated for general use; nickel‑under‑gold plating for harsh‑environment anti‑oxidation performance
6. Pin‑count coverage: 2×2P up to 2×40P; custom pin‑tail length and housing height are supported
7. RoHS/REACH compliant, supplied in bulk bag or box packing for high‑volume assembly

Product Advantage

1. Strong PCB retention: DIP through‑hole soldering delivers far better mechanical stability than SMT headers for vibration‑prone equipment, preventing connector lifting off PCB.
2. Full ecosystem compatibility: 2.54 mm industry standard pitch reduces component sourcing risk; drop‑in replacement for mainstream market equivalents.
3. Dual‑row high‑density layout: Double‑row design packs more signal channels within shorter PCB footprint vs single‑row solutions, saves board space.
4. Dual‑grade plating solution: Tin‑plated variant controls BOM cost for commercial‑grade products; gold‑plated option mitigates oxidation for outdoor / high‑humidity long‑life devices.
5. Fast project iteration: Off‑the‑shelf standard pin counts for quick prototyping; custom dimensions available for OEM mass production.
6. Assembly‑friendly: Insulator resists wave‑solder heat distortion, lower assembly reject rate on SMT / wave‑solder production lines.

Application

• Industrial control boards, PLC peripheral modules
• Embedded systems, single‑board computers, development boards
• IoT sensor gateways, smart home hardware
• Test & measurement equipment
• Robotics auxiliary control modules
• Automotive interior auxiliary electronics
• Medical non‑critical signal modules
• Consumer electronics, prototyping & DIY equipment

Customization Options

1. Confirm pin configuration: Define total pin quantity (2×N), double‑row layout; verify matching male header pitch and row spacing strictly at 2.54 mm.
2. Mounting check: Select DIP straight version when strong mechanical shock resistance is required; choose right‑angle variant if side‑mating is needed.
3. Plating selection:
   • Tin plating: indoor commercial devices, normal humidity environment, cost‑sensitive projects.
   • Gold plating: outdoor, high‑humidity, long service‑life, frequent plug‑unplug scenarios.
4. PCB footprint validation: Confirm PCB hole diameter matches DIP pin dimension; check insulator height to avoid mechanical interference with surrounding components.
5. Thermal matching: If wave‑soldering process is applied, confirm insulator material meets soldering temperature requirement.
6. Custom requirement: Submit drawing for non‑standard pin‑tail length, insulator height or special pin‑count.