Products
Manufacturer of a wide range of products which include 2 Layer Heavy Copper PCB FR4 4oz PCB Rigid ENIG 200.03mm*145.06mm,FR4 10 Layer 4oz Thick Copper PCB For Power Supply Products ENIG,ENIG Heavy Copper PCB Circuit Board FR4 4oz ...
MOQ: Negotiable
Price: Negotiable
| Layer count | 2 |
| Copper thickness | 4/4 |
| Board thickness | 1.60 |
| Min hole size | 0.20 |
| Aspect ratio | 0.13 |
| Material | FR4 |
| Surface treatment | ENIG |
| Profile | 200.03mm*145.06mm |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
| material | FR4 |
| layer count | 10 |
| Surface finishing | ENIG |
| Application | power supply |
| Board thickness | 2.6mm |
| size | 180mm*220.5mm |
| Min. hole size | 0.35mm |
| Copper thickness | 4oz |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
| Layer count | 2 |
| Copper thickness | 4/4 |
| Board thickness | 1.60 |
| Min hole size | 0.40 |
| Aspect ratio | 0.25 |
| Material | FR4 |
| Surface treatment | ENIG |
| Name | Printed Circuit Boards |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
| material | FR4 |
| layer count | 24 |
| Surface finishing | OSP |
| Application | power supply |
| Board thickness | 4.40mm |
| Min. line width | 0.20mm |
| Min. line spacing | 0.11mm |
| Tg | 170 |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
| Layers | 6L |
| Material | FR4 |
| Solder Mask | Green |
| Silkscreen | No |
| Surface Finish | ENIG |
| Finished copper | 3oz |
| Board thickness | 3.0mm |
| Dimension | 19.3*21mm |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
| material | FR4 |
| layer count | 16 |
| Surface finishing | ENIG |
| Application | electric source |
| Board thickness | 3.6mm |
| size | 58.42*36.83mm |
| Min. hole size | 0.50mm |
| Copper thickness | 5oz |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: Negotiable
Price: Negotiable
| Layer | 12L |
| Materail | FR4 TG170 3.8mm |
| Copper thickness | 2/4/4/4/4/4/4/4/4/4/4/2OZ |
| Surface finish | EING |
| Speical | Resin plugging+ hole plated over,depth drilling |
| Packaging Details | Vaccum package |
| Delivery Time | Negotiable |
| Payment Terms | T/T |
| Place of Origin | China |
| Brand Name | Customized |
| Certification | UL,ISO9001 |
MOQ: 1 Panel
Price: Negotiated
| Place Of Origin | China |
| Payment Terms | T/T |
| Delivery Time | 1-2 weeks |
| Packaging Details | Vacuum package |
| PCB Item | FR4 TG150 1.6mm |
| Min Hole Size | 0.2MM |
| Surface finish | Immersion Gold |
| Pcba Service | SMD SMT DIP Component Assembly |
| Copper Thicknes | 3oz |
| Test | IPC Class 2 |
| Minimum Line Space | 3mil (0.075mm) |
| Certification | ISO9001, ISO14001. TS16949 |
MOQ: 1 panel
Price: Negotiation
| Place Of Origin | China |
| Payment Terms | T/T |
| Delivery Time | 8-10 days |
| Packaging Details | MBB package |
| layer | 4 layer |
| Materail | FR4 TG150 1.6MM |
| Copper Thicknes | 3/2/2/3OZ |
| Test | IPC Class 2 |
| Solder Mask Color | Green |
| Package | Vacuum Package |
| Min Hole Size | 0.2MM |
| Technology | LF HAL+ golden finger 0.76um |
| Certification | ISO9000, TS16949 |
MOQ: 1 panel
Price: Negotiation
| Place Of Origin | China |
| Payment Terms | T/T |
| Delivery Time | 1-2 weeks |
| Packaging Details | Vacuum package |
| Item | Custom Circuit Board 10 layer |
| Copper Thicknes | 1oz for every layer |
| Board Thickness | FR4 TG150 1.6MM |
| Pcba Service | SMD SMT DIP Component Assembly |
| Technology | Impendace control, golder finger+ Bevel |
| Minimum Line Space | 3mil (0.075mm) |
| Minimum Hole Size | 0.2mm |
| Min Hole Size | 0.2MM |
| Certification | ISO9001, TS16949 |
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