GT SMART (Changsha) Technology Co., Limited
| Place Of Origin | China |
| Payment Terms | T/T |
| Delivery Time | 1-2 weeks |
| Packaging Details | Vacuum Package |
| Thickness | 1.6mm |
| Surface Fnishring | LF HAL |
| Special | Copper Base materail |
| Applications | Industrial,power |
| Product Type | Copper Base PCB |
| Brand Name | Customized |
| Certification | ISO9001, TS16949, ISO14001, |
View Detail Information
Explore similar products
3.0mm 4 Layer Copper PCB Board Green ENIG Cu Base S1000-2M+3W/*k
LF HASL Copper PCB 1oz Circuit Board Printed 1 Layer Cu Based
Copper OSP PCB Finish 2w 10z Key Board PCB 1.6mm Board Thickness
6 Layer Copper PCB Reliable FR4 Industrial Control PCB 250mm*220mm
Product Specification
| Place Of Origin | China | Payment Terms | T/T |
| Delivery Time | 1-2 weeks | Packaging Details | Vacuum Package |
| Thickness | 1.6mm | Surface Fnishring | LF HAL |
| Special | Copper Base materail | Applications | Industrial,power |
| Product Type | Copper Base PCB | Brand Name | Customized |
| Certification | ISO9001, TS16949, ISO14001, | ||
| High Light | Customized Copper PCB Board 1.6mm ，High-Performance Copper PCB ，Copper PCB Board with Warranty | ||
| Product type | Copper base PCB Board |
| Applications | Industrial, Power |
| Surface Finishing | LF HAL |
| Thickness | 1.6mm |
| Feature | Copper Base PCB (MCPCB) | Normal FR4 PCB |
| Core Material | Solid Copper plate/core. | FR4 (Fiberglass woven cloth and epoxy resin). |
| Primary Advantage | Thermal Management (Heat Dissipation). | Cost-Effectiveness and Design Flexibility. |
| Thermal Conductivity (W/m·K) | Excellent: Up to 400 W/m·K (Pure Copper). | Poor: Typically 0.3 to 0.4 W/m·K (Epoxy Resin). |
| Current Handling | Very High. The thick copper base can also be used as a ground/power plane or heat sink. | Limited. Relies on the copper trace thickness (typically 1-2 oz). |
| Mechanical Strength | High Rigidity. The metal core provides excellent durability and resistance to warping/vibration. | Moderate. Sufficient for most consumer electronics but less robust. |
| Coefficient of Thermal Expansion (CTE) | Lower and Better Matched to the copper circuit layers. | Higher (especially in the Z-axis), leading to thermal stress and potential PTH/via failure during temperature cycling. |
| Design Flexibility | Limited Layer Count (mostly single or double-sided) due to the solid metal core. | Excellent. Supports complex, multi-layer designs (4, 6, 8+ layers) for high-density routing. |
| Cost | Higher. Copper is an expensive material, and processing is more specialized. | Low. Cost-effective and widely available for mass production. |
| Typical Applications | High-power LEDs, motor controllers, power supplies, automotive electronics, and high-frequency communication modules. | Consumer electronics (smartphones, computers), low-to-mid power devices, and complex digital circuits. |
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
500million-1000million
Employee Number:
300~400
Ecer Certification：
Verified Supplier
Golden Tringle Group LTD GT Tringle Group Ltd. is to provide “From idea to product” for full features of electronics, we provide a one-stop service to help customers with sourcing; We are group companies that includes ODM service, PCB design, PCB manufacturing, PCB assemb... Golden Tringle Group LTD GT Tringle Group Ltd. is to provide “From idea to product” for full features of electronics, we provide a one-stop service to help customers with sourcing; We are group companies that includes ODM service, PCB design, PCB manufacturing, PCB assemb...
Get in touch with us
Leave a Message, we will call you back quickly!