GT SMART (Changsha) Technology Co., Limited
| Payment Terms | T/T,Negotiation |
| Packaging Details | ESD plastic Packing |
| Product name | Printed Circuit Board assembly,PCB Assembly |
| Base material | FR4 Normal TG 1.6mm |
| Copper thickness | 1/1OZ |
| Surface finish | Lead free HASL |
| Soldermask | White |
| Service | One-stop Turnkey Service, PCB assembly, PCB/Components Sourcing/Soldering/Progamming/Testing.. |
| Brand Name | Customisation |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Negotiation | Packaging Details | ESD plastic Packing |
| Product name | Printed Circuit Board assembly,PCB Assembly | Base material | FR4 Normal TG 1.6mm |
| Copper thickness | 1/1OZ | Surface finish | Lead free HASL |
| Soldermask | White | Service | One-stop Turnkey Service, PCB assembly, PCB/Components Sourcing/Soldering/Progamming/Testing.. |
| Brand Name | Customisation | Certification | ISO9001 |
| Place of Origin | China | ||
| High Light | 1 Layer Printed Circuit Board Assembly ，White Soldermask Printed Circuit Board Assembly ，1OZ Copper PCB Assembly | ||
Product description:
| Product name | Printed circuit Assembly |
| Layer | 2 layer |
| Copper thickness | 1/1 OZ |
| Soldermask/Silkscreen | White/Black |
| Surface finish | LF HAL |
| Service | One-stop Turnkey Service,PCB assembly, |
Assembly Technologies:
Printed circuit board assembly is a crucial step in the PCB manufacturing process of electronic devices. Here are some technologies involved in PCB assembly:
Surface Mount Technology (SMT): Components are mounted directly onto the surface of the PCB. This technology allows for smaller components and denser PCB layouts.
Through-Hole Technology (THT): Components with wire leads are inserted into holes in the PCB and soldered on the opposite side. THT is used for components requiring mechanical strength or heat dissipation.
Automated Optical Inspection (AOI): AOI systems use cameras and image processing algorithms to inspect solder joints and components for defects such as misalignment, missing components, or solder bridges.
X-Ray Inspection: X-ray machines are used to inspect hidden solder joints, check for voids in solder, and ensure the integrity of components like ball grid arrays (BGAs).
In-Circuit Testing (ICT): ICT involves testing the electrical connections on the PCB using test probes. This method is used to detect faults like open circuits, shorts, and incorrect components.
Flying Probe Testing: Instead of using dedicated test fixtures, flying probe testers have moving test probes that can adapt to various PCB designs, making them suitable for low-volume production.
Functional Testing: This involves testing the PCB while it is operational to ensure that it functions according to the design specifications. These processes and technologies collectively ensure the quality and reliability of PCB assemblies in electronic devices.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
500million-1000million
Employee Number:
300~400
Ecer Certification：
Verified Supplier
Golden Tringle Group LTD GT Tringle Group Ltd. is to provide “From idea to product” for full features of electronics, we provide a one-stop service to help customers with sourcing; We are group companies that includes ODM service, PCB design, PCB manufacturing, PCB assemb... Golden Tringle Group LTD GT Tringle Group Ltd. is to provide “From idea to product” for full features of electronics, we provide a one-stop service to help customers with sourcing; We are group companies that includes ODM service, PCB design, PCB manufacturing, PCB assemb...
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