Foisontech Corporation Co., Limited
Products
Manufacturer of a wide range of products which include HDI PCB Board 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated,Green Solder Mask Prototype High Density Interconnect HDI PCB High TG Material,Double-Sided Comm...
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 10 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | Immersion Gold |
| Solder Mask | Green |
| Board Size | 60 * 52 Mm |
| Min. Aperture | 0.4MM |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L0888 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 20 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | Immersion Gold |
| Solder Mask | Green |
| Board Size | 300 * 210 Mm |
| Min. Aperture | 3Mil |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L06666 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 2 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | HASL |
| Solder Mask | Green |
| Board Size | 330*220 MM |
| Min. Aperture | 0.3MM |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 2 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | HASL |
| Solder Mask | Green |
| Board Size | 330*220 MM |
| Min. Aperture | 0.3MM |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 2 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | OSP |
| Solder Mask | Green |
| Board Size | 210*132 MM |
| Min. Aperture | 0.3MM |
| Min. Line Trace Width/Space | 0.15 / 0.15 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 6 Layer |
| Board Thickness | 1.2MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | OSP |
| Solder Mask | Green |
| Board Size | 75 * 38 Mm |
| Min. Aperture | 0.2MM |
| Min. Line Trace Width/Space | 0.1 / 0.1 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 6 Layer |
| Board Thickness | 1.2MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | OSP |
| Solder Mask | Green |
| Board Size | 75 * 38 Mm |
| Min. Aperture | 0.2MM |
| Min. Line Trace Width/Space | 0.1 / 0.1 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 4 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | OSP |
| Solder Mask | Green |
| Board Size | 150 * 131 Mm |
| Min. Aperture | 0.25MM |
| Min. Line Trace Width/Space | 0.1 / 0.1 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 4 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | OSP |
| Solder Mask | Green |
| Board Size | 150 * 131 Mm |
| Min. Aperture | 0.25MM |
| Min. Line Trace Width/Space | 0.1 / 0.1 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
MOQ: 1
Price: Negotiable
| Payment Terms | T/T, Western Union, L/C |
| Supply Ability | 300, 000 sqm Per Month |
| Delivery Time | 5-8 working days |
| Packaging Details | INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON |
| Raw Material | Fr - 4 |
| Layer Count | 4 Layer |
| Board Thickness | 1.6MM |
| Copper Thickness | 1 Oz / 35 µm |
| Surface Treatment | OSP |
| Solder Mask | Green |
| Board Size | 150 * 131 Mm |
| Min. Aperture | 0.25MM |
| Min. Line Trace Width/Space | 0.1 / 0.1 MM |
| Brand Name | FOISON |
| Model Number | FSD0002L066 |
| Certification | ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000 |
| Place of Origin | Shenzhen,China |
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