Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 |
| Layer | 2 |
| Color | Green |
| Min line space | 5mil |
| Min line width | 5mil |
| Copper thickness | 1OZ |
| Board size | 200*105mm |
| Panel | 1 |
| Surface | HASL-LF |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 | Layer | 2 |
| Color | Green | Min line space | 5mil |
| Min line width | 5mil | Copper thickness | 1OZ |
| Board size | 200*105mm | Panel | 1 |
| Surface | HASL-LF | Brand Name | XCE |
| Model Number | XCEM | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | pcb board assembly ，smt pcb assembly | ||
Multilayer PCB SMT DIP Electronic PCBA SMT Service 1.6MM Electronic Board
Quick detail:
| Origin:China | Special: PCB Assembly |
| Layer:2 | Thickness:1.6mm |
| Surface: HASL-LF | Hole:0.8 |
Specification:
We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement
Typical Applications
SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
Chip Programming
Conformal Coating
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard
PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
vProgram Management
PCB Files →DCC →Program Organizing →Optimization →Checking
vSMT Management
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
vPCBA Management
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
PCB Assembly Capability
| Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
| Type of Assembly | SMT,Thru-hole, DIP |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
| Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
| File Formate | Bill of Materials Gerber files Pick-N-Place file |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | Flying Probe Test,X-ray Inspection AOI Test |
Our PCB assembly capability and services: SMT / THT / DIP.
1. Component Purchasing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. Packing design
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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