Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Base material | Rogers4350 |
| Name | Rogers PCB |
| Board thickness | 1.2mm |
| Surface finish | Immersion gold |
| Brand Name | XCE |
| Model Number | XCER-2 |
| Certification | CE,ROHS, FCC,ISO9008 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Base material | Rogers4350 | Name | Rogers PCB |
| Board thickness | 1.2mm | Surface finish | Immersion gold |
| Brand Name | XCE | Model Number | XCER-2 |
| Certification | CE,ROHS, FCC,ISO9008 | Place of Origin | China |
| High Light | custom pcb printing ，printed circuit board design | ||
24GHZ Rogers 4350 PCB Sensor Boards
Number of layer: 2
Board size: 2.6*2.6cm
Panel size: 30*18cm
Color: Green solder mask black silk screen
Craft edge:yes
Surface finish: Immersion gold
Material: Rogers 4350 0.508mm
Parameter
| Profile tolerance | ±0.10mm(4mil)c | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
| Laminate | ||||
| Technology Index | Mass production | Middle and Small Volume | Prototype | |
| FR4 | Normal Tg | S1141 (Not Recommander for HF ) | ||
| Middle Tg | S1000H(HDI, Mul-layer Board)) | |||
| High Tg | S1000-2M, IT180A(Heavy Copper, Multi-Layer Board) | |||
| Halogen Free | Middle Tg | S1150g | ||
| High Tg | s1165 | |||
| Ceramics Filled High Frequency Board | Rogers series,Arlon Series,Toconic Series,Taizhou Lin Wang | |||
| Special PP | Low Flow PP, Arlon 49N | |||
| Ceramic Filled, Rogers4450, Arlon25FR | ||||
| PTFE PP, Arlon 6700,Taconic FR-27 | ||||
| Rigid PI | Arlon 85N,Shenyi SH260 | |||
| Metal-Substrate | Bercquist AL Substrate, Copper Substrate | |||
| Pure Ceramics Material | N/A | |||
| Note: For other material not involed, We can purchase or help to purchase for customers special requirements. | ||||
| Technology Index | Mass production | Middle and Small Volume | Prototype | |
| Layer | FR4 Series | 20 | 28 | 36 |
| Rigid Flex/Flex | 6(4) | 10(8) | 16(12) | |
| High Frequency Hibrid Laminate | 12 | 18 | 24 | |
| Pure PEFE | 4 | 8 | 12 | |
| Metal Core | 2 | 4 | 4 | |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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