Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Min line space | 0.2mm |
| Min line width | 0.2mm |
| Copper thickness | 2OZ |
| Size | 8*6cm |
| Board THK | 1.2MM |
| Panel | 1 |
| Surface finish | ENIG+Gold plated |
| Color | green |
| Material | FR4 High TG |
| Model | XCEM |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Min line space | 0.2mm | Min line width | 0.2mm |
| Copper thickness | 2OZ | Size | 8*6cm |
| Board THK | 1.2MM | Panel | 1 |
| Surface finish | ENIG+Gold plated | Color | green |
| Material | FR4 High TG | Model | XCEM |
| Brand Name | XCE | Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | multi layered pcb ，multilayer pcb fabrication | ||
2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression
Specification:
Type: 2+6+2 Stack up Impedance HDI
Material:
Layer Count: 10
Finish Thickness: 1.2+8%mm
Min. Via dia: 0.2mm
Surface Finish: ENIG+Hard Gold Plating
Specialty:
L1-2, L2-3, L8-9, L9-10: Resin fill, laser blind via of 0.1mm; L3-8: Buried via and resin filled.
Parameter:
| PCB parameter | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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