Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Surface finish | ENIG |
| Board THK | 0.635 mm |
| Product name | rogers 6006pcb |
| Size | 3*3 CM |
| Brand Name | XCE |
| Model Number | XCEr |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Surface finish | ENIG | Board THK | 0.635 mm |
| Product name | rogers 6006pcb | Size | 3*3 CM |
| Brand Name | XCE | Model Number | XCEr |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | Pcb Board Prototype ，Pcb Design And Fabrication | ||
2 Layer Rogers Sensor PCB Duroid Ro6006 DK6.15 0.635mm High Frequency
Specification:
| Brand: XCE |
| Model: XCEr |
| Board size: 3*3cm |
| Cu thickness: 35UM |
| Material: rogers |
| Min line space&width: 5Mil |
Parameter:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Description:
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Nowadays, higher frequencies are applied to electronic circuits in a wide range of areas.
In order to meet the increasing demand for miniaturization and to utilize high frequency, higher-density PCBs are necessary.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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