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SHANGHAI FAMOUS TRADE CO.,LTD

  • China,Shanghai ,Shanghai
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China ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire
China ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire

  1. China ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire
  2. China ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire
  3. China ​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire

  1. MOQ: 1
  2. Price: By case
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Payment Terms T/T
Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room
Main Motor Power 11KW – 75KW
Wire Speed 0 – 40(m/s)
Max. Wire Length​ 20 – 150m
Power Supply​ Standard: Three-phase, 380V, 50Hz
Walking Motor Power​ 0.75KW – 1.5KW
Rotation Angle​ 360°(Electric Control)
Control Automatic/manual operation. Some models adopt CNC or PLC control systems.
Allowed Working Temperature​​ -15℃ ~ +40℃
Brand Name ZMSH
Model Number Wire Saw Equipment
Certification rohs
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Delivery Time 3-6 months
Packaging Details package in 100-grade cleaning room Main Motor Power 11KW – 75KW
Wire Speed 0 – 40(m/s) Max. Wire Length​ 20 – 150m
Power Supply​ Standard: Three-phase, 380V, 50Hz Walking Motor Power​ 0.75KW – 1.5KW
Rotation Angle​ 360°(Electric Control) Control Automatic/manual operation. Some models adopt CNC or PLC control systems.
Allowed Working Temperature​​ -15℃ ~ +40℃ Brand Name ZMSH
Model Number Wire Saw Equipment Certification rohs
Place of Origin CHINA
High Light vertical wire saw for sapphire cuttinghorizontal wire saw for ceramicsmulti-wire saw for marble materials

​​Equipment Overview and Core Value​​

 

 

​​Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting​​ for Sapphire/Ceramics/Marble Materials

 

 

 

The wire saw equipment utilizes a high-speed diamond wire as the cutting tool, where diamond abrasives are fixed onto a metal wire via electroplating or resin bonding, forming a flexible cutting system. Its core value lies in achieving ​​high-precision, low-damage cutting​​, significantly improving the processing efficiency and material utilization of hard and brittle materials (e.g., sapphire, ceramics, marble), overcoming the limitations of traditional methods in efficiency and accuracy.

 

 

 

 


 

​​Material Processing Characteristics and Applications​​

 
 
​​Material Dimension​​ ​​Sapphire​​ ​​Ceramics​​ ​​Marble​​
​​Core Characteristics​​ Ultra-high hardness (Mohs 9), high brittleness High hardness, high elastic modulus Non-uniform material, contains hard points like quartz
​​Processing Challenges​​ Prone to edge chipping and cracks Cutting surface prone to micro-cracks Uneven cutting surface and edge chipping
​​Key Metrics​​ Surface roughness can reach ​​Ra<0.5μm​​ Pursuit of cutting surface integrity, reducing micro-cracks High cutting efficiency, good slab flatness
​​Application Directions​​

LED substrates, optical windows, semiconductor substrates

 

Electronic ceramic substrates, packaging materials, structural ceramics

 

Architectural decorative slabs, countertops, carving crafts

 

 

 


 

​​Working Principle Highlights​​

 
 

The equipment grinds materials through a continuously circulating diamond wire at high speed, with technical focus varying by material:

  1. ​​Sapphire​​: Requires precise control of parameters like wire speed and tension to avoid brittle fracture (e.g., 20 m/s wire speed and 50 N tension can achieve a surface roughness of Ra<0.5μm).
  2. ​​Ceramics​​: Relies on the grinding action of the diamond wire to reduce stress concentration and minimize micro-crack generation.
  3. ​​Marble​​: Adapts cutting parameters intelligently to accommodate stone heterogeneity, ensuring flat cuts.

 

 

 

 


 

​​Processing Methods and Effects​​

 
 
​​Material​​ ​​Block Cutting​​ ​​Cross Cutting​​ ​​Multi-Wire Cutting​​ Effects​​
​​Sapphire​​ Narrow kerf (0.55mm), surface roughness <1μm, reduces material loss Fast cutting speed, suitable for ingot truncation and shaping Simultaneous multi-slice cutting enhances efficiency for materials like silicon wafers
​​Ceramics​​ Neat cutting surface, minimal edge damage, ideal for standard substrate preparation Suitable for precision machining of special-shaped components, high flexibility High-volume production of uniform components with high efficiency
​​Marble​​ High cutting efficiency, flat slab surface beneficial for subsequent polishing Used for block shaping and large slab division Single cut generates multiple large slabs, suitable for large-scale projects
 
 
 
 
 

 

​​Core Parameters​​

 
 
​​Parameter​​ ​​Range/Specification​​
Main Motor Power 11–75 kW (common models: 22kW, 37kW, 55kW)
Wire Speed 0–40 m/s (high-speed models up to 45 m/s)
Maximum Wire Length 20–150 m (increases with power)
Power Supply Three-phase 380V/50Hz (customizable)
Control Method Automatic/manual, supports CNC or PLC systems
Operating Temperature -15°C ~ +40°C

 

 


 

​​Service Commitment​​

 

 

ZMSH provides ​​integrated manufacturing and trading solutions​​, covering equipment selection, process optimization, and after-sales support:

  • ​​Customized Design​​: Configures parameters based on material properties (e.g., hardness, size).
  • ​​Technical Training​​: Offers operation and maintenance training to ensure efficient equipment performance.
  • ​​Full-Cycle Service​​: Provides end-to-end technical support and rapid response from trial cuts to mass production.

 

 

 

 


 

FAQ of Wire Saw Equipment

 

 

​​Q1: How does a wire saw equipment achieve precise cutting?​​

A1: The equipment uses a high-speed diamond-coated wire that acts as a flexible grinding tool, abrasively cutting through materials while maintaining minimal kerf loss and high accuracy due to controlled tension and linear motion.

 

​​Q2: What makes wire saws suitable for environmentally sensitive operations?​​

A2: Wire saws eliminate the need for cooling fluids in many cases, reduce waste generation by up to 80% compared to traditional methods, and operate with lower noise and energy consumption, aligning with green manufacturing standards.

 

​​Q3: How do wire saws handle complex shapes or large-scale projects?​​

A3: With multi-wire configurations, they can simultaneously cut multiple slices from a single block, enabling efficient processing of intricate geometries or massive slabs—ideal for architectural stonework or semiconductor wafer production.

 

 


Tags: #Wire Saw Equipment, #Customized, #Vertical/Horizontal/Multi-Wire Cutting, #Sapphire/Ceramics/Marble Materials

   
 
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Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Agent,Importer,Exporter,Trading Company

  • Year Established:

    2013

  • Total Annual:

    1000000-1500000

  • Ecer Certification:

    Verified Supplier

    SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...     SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...

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  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
  • https://www.galliumnitridewafer.com/

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