L‑Type Automatic SMT Unloader, PCB Board Unloading Machine

Product Specification

L-Type SMT PCB Receiving Machine (Fully Automatic)

I. Product Overview

The L-type PCB receiving machine, also known as a board unloading machine or material receiving machine, is a specialized automated board receiving device for the back end of SMT and DIP production lines. It comes in two specifications, 250S and 330S, to accommodate PCBs of different sizes. The machine adopts a compact L-shaped structure, automatically collecting finished boards and switching material frames, replacing manual board handling, reducing board scratches and bumps, improving the automation continuity of the entire production line, and is suitable for the post-soldering and inspection receiving processes of various electronic circuit boards.

II. Parameter Tables

Table 1: General Basic Parameters for the Whole Machine (Applicable to Both Models)

Parameter Name | Parameter Value

Conveying Height: 900±30mm

Power Supply: 220V/0.35KW

Conveying Direction: Right-Left / Left-Right (Bidirectional Selection)

Frame Replacement Time: Approx. 20 seconds

Frame Configuration: 1 Working Frame + 1 Standby Frame

Working Air Pressure: 4-6 bar

Conveying Track: Monorail Conveyor

Control System: PLC Host + Touch Screen HMI

Machine Weight: 150kg

Communication Interface: Standard SMEMA, Seamless Integration with Production Line Equipment

Lifting Platform Pitch: 10/20/30/40/50mm (Multiple Adjustable Levels)

Table 2: Dimensional Parameters for Two Specific Specifications

Equipment Specifications - Compatible PCB Size - Matching Frame Size - Overall Machine Dimensions (Length, Width, Height) - Adaptable to Production Needs

250S - Board width 50-250mm, longest board 350mm - 355320563mm - 1000*1000*1680mm - Suitable for small to medium-sized PCB batch receiving

330S - Board width 50-330mm, longest board 450mm - 460400563mm - 1200*1200*1680mm - Suitable for large-size circuit board receiving

III. Core Product Features

1. Basic Standard Configuration

1. Mature PLC control system, stable continuous long-term operation, low failure rate;

2. Standard SMEMA communication interface, compatible with all SMT/DIP equipment such as reflow soldering, wave soldering, testing instruments, and through-hole lines;

3. Dual fault reminders: audible and visual alarms + screen pop-up window, rapid anomaly location, reducing downtime.

2. Equipment Advantages

1. Fully enclosed sheet metal and aluminum alloy unibody construction provides a higher level of safety protection, preventing pinching, dust, and impacts.

2. Stepper motor paired with ball screw drives the material frame lifting, ensuring smooth and vibration-free lifting and minimizing material deformation.

3. Three-point pneumatic clamping and positioning, combined with a hand-cranked screw width adjustment, ensures no material frame offset and neat alignment during board retraction.

4. Dedicated push-plate buffer protection structure prevents damage to finished PCBs and components from compression, significantly reducing process scrap and waste.

5. Touchscreen with built-in automatic fault diagnosis and one-click parameter adjustment makes it easy for beginners to use, requiring no professional maintenance.

IV. Application Scenarios

1.Reflow Soldering Back‑end: Automatically collect PCBs after reflow soldering to replace manual operation. Prevent high‑temperature scald risks and board scratches, maintain finished‑board appearance quality.

2.PCB Manufacturing Mid‑stage: Automatically collect semi‑finished PCBs after pattern transfer, etching, solder masking and other procedures, keep continuous production flow.

3.DIP Insertion Line End: Automatically collect component‑inserted circuit boards and stack neatly inside material frames, convenient for subsequent wave soldering and function test transfer.