Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
| Payment Terms | L/C,T/T |
| Supply Ability | Negotiation |
| Delivery Time | Negotiation |
| Packaging Details | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Film Appearance | The base material shall achieve atomic-scale surface uniformity while exhibiting total elimination of morphological irregularities, nanoscale particulate embeddings, cross-linked polymer clusters, or non-native impurities throughout its operational zone, w |
| Film Thickness (um) | 5 7.5 |
| Film Tensile Strengthh | 170MPa |
| Film Elongation at break | 55% |
| Film Young's Modulus | 3GPa |
| Film Insulation Strength | 100V/μm |
| Luster | 31GU |
| Flame Retardant | VTM-0 Level |
| Brand Name | Guofeng |
| Model Number | GB |
| Certification | UL ISO RoHS |
| Place of Origin | China Hefei |
View Detail Information
Explore similar products
Flexible Electronics Yellow Heating Polyimide PI Film High Temperature Resistant
514MM 25μM Thermal Electrical Plastic Polyimide PI Film Non Flammable
Conventional Opaque Black Polyimide Thin Film Masking Membrane GB Standard
GC Type Aluminized Polyimide Insulation Tape Film Carbon Based Membrane
Product Specification
| Payment Terms | L/C,T/T | Supply Ability | Negotiation |
| Delivery Time | Negotiation | Packaging Details | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Film Appearance | The base material shall achieve atomic-scale surface uniformity while exhibiting total elimination of morphological irregularities, nanoscale particulate embeddings, cross-linked polymer clusters, or non-native impurities throughout its operational zone, w | Film Thickness (um) | 5 7.5 |
| Film Tensile Strengthh | 170MPa | Film Elongation at break | 55% |
| Film Young's Modulus | 3GPa | Film Insulation Strength | 100V/μm |
| Luster | 31GU | Flame Retardant | VTM-0 Level |
| Brand Name | Guofeng | Model Number | GB |
| Certification | UL ISO RoHS | Place of Origin | China Hefei |
| High Light | Substrate Polyimide PI Film ，Polyimide PI Film Base Material ，Submicron polyamide imide film | ||
Engineered for discrete electronics applications, our proprietary GB-series opaque polyimide cladding is formulated specifically for security-sensitive flexible circuit architectures. This specialized overlay maintains polyimide's characteristic dielectric strength, thermal endurance (>400°C), and mechanical stability while integrating permanent blackout properties that effectively obstruct visual and optical circuit analysis. The anti-reflective matte surface treatment (60° gloss <5 GU) eliminates specular reflection, ensuring reliable machine vision inspection accuracy by preventing CCD misinterpretation.
Product application:
The GB-series submicron opaque polyimide matrix is strategically implemented in:
1) electromagnetic wave-transparent cladding for resonant power transfer systems
2) electrochemical interface layers for high-voltage energy storage modules
3) thermal-enduring covert marking systems for industrial authentication
4) multi-layer dielectric separation media for high-frequency electronics.
Company Details
Business Type:
Manufacturer
Year Established:
2021
Total Annual:
28000-50000
Employee Number:
100~300
Ecer Certification：
Verified Supplier
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Guofeng Xianji Company, a wholly-owned subsidiary of Guofeng New Material, is a high-tech enterprise specializing in the R&D, production, sales, and service of high-performance polyimide (PI) materials. PI film, commonl... Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Guofeng Xianji Company, a wholly-owned subsidiary of Guofeng New Material, is a high-tech enterprise specializing in the R&D, production, sales, and service of high-performance polyimide (PI) materials. PI film, commonl...
Get in touch with us
Leave a Message, we will call you back quickly!