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{"title":"Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation","imgUrl":"https:\/\/img.chinax.com\/nimg\/d3\/b0\/d92b8457810f38162fe383139a6e-200x200-1\/polyimide_base_substrates_for_fpc_manufacturing_and_semiconductor_encapsulation_26_packaging.jpg","attrs":{"Model Number":"7.5um","Color":"Transparent","Payment Terms":"L\/C,T\/T","Insulation":"Excellent Insulation"}}
{"title":"Polyimide Core Film for Flexible Printed Circuits & Semiconductor Packaging","imgUrl":"https:\/\/img.chinax.com\/nimg\/b5\/08\/9bbf836b0dd3b41504a6e69193e5-200x200-1\/polyimide_core_film_for_flexible_printed_circuits_26_semiconductor_packaging_fields.jpg","attrs":{"Brand Name":"Guofeng","Model Number":"7.5um","Certification":"UL ISO ROHS","Place of Origin":"China"}}
{"title":"Polyimide Core Film Used in Flexible Printed Circuits and Semiconductor","imgUrl":"https:\/\/img.chinax.com\/nimg\/03\/cc\/91b6a16d73fc9d23814bf740c008-200x200-1\/polyimide_core_film_used_in_flexible_printed_circuits_and_semiconductor_packaging.jpg","attrs":{"Brand Name":"Guofeng","Model Number":"7.5um","Certification":"UL ISO ROHS","Place of Origin":"China"}}
{"title":"Black Opaque Polyimide Composite flexible polyimide film with High Adhesion","imgUrl":"https:\/\/img.chinax.com\/nimg\/0e\/a1\/459dfe01d87551cd5752d1454f51-200x200-1\/black_opaque_polyimide_composite_flexible_polyimide_film_with_high_adhesion_strength_for_flexible_circuits.jpg","attrs":{"Brand Name":"Guofeng","Model Number":"7.5um","Certification":"UL ISO ROHS","Place of Origin":"China"}}
High‑Dependability Copper‑Polyimide Composite Suited for Dynamic Bending Conditions
Product Overview:
The GL‑grade product line establishes a new performance benchmark for polyimide films. Our in‑house manufacturing process delivers substantially optimized molecular structures, delivering over 30‑percent improvements in key metrics including tensile strength, dimensional stability and chemical resistance versus standard‑grade alternatives. Boasting high‑performance characteristics, this native‑yellow polyimide film supports customizable thickness specifications. It serves as an indispensable raw material for high‑stake scenarios, ranging from high‑reliability adhesive‑bonded substrates to sophisticated chip‑packaging solutions.
Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Attributes:
Superior Mechanical Robustness
Excellent Dimensional Consistency
Premium Lamination Performance
Compliant with RoHS and REACH regulatory requirements
Product Applications:
High‑density flexible copper clad laminates (FCCL) for FPC fabrication
Dimensionally stable coverlays for circuit protection
Advanced encapsulation and packaging for semiconductor devices
High‑performance substrates for specialty adhesive tapes
In order to retain full integrity and performance of our polyimide film, kindly comply with these storage recommendations:
Shelf Life: 6 months upon production date.
Preferred Environment: Store within cool, dry premises with consistent ambient parameters.
Precautions: Retain factory‑sealed original packaging. Shield the material against direct sunlight, dampness and extreme thermal conditions.