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ODM Polyimide Film Adhesive Base Material for Circuit & Chip Encapsulation
Product Overview
The GL high-performance polyimide film is a type of biaxially stretched natural (yellow) polyimide film, developed and produced independently by our company. Available in various thicknesses and characteristics, it is primarily used in adhesive substrates, chip packaging, and other specialized applications.
The GL high-performance polyimide film is primarily used in:
High-precision adhesive FCCL substrates
High-stability cover films
Chip packaging
Special adhesive tape substrates
Why Choose Our Factory?
Direct Manufacturer Pricing: Eliminate intermediaries with competitive costs, flexible MOQs, and fast delivery
Technical Expertise: Customized anti-fog testing and packaging optimization support
Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!
Handling & Storage Instructions
To ensure the longevity and performance of our Polyimide film:
Shelf Life: 6 months from the date of manufacture
Storage Conditions:
Store in a cool, dry place away from direct sunlight
Avoid exposure to high humidity or extreme temperature fluctuations