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HP-VP450 Vacuum Glue Potting Machine 400*400*100mm Working Range, ±2% Dispensing Accuracy, 200Pa Ultimate Vacuum for Bubble-Free Potting
Product Overview
The HP-VP450 Vacuum Glue Potting Machine is a high-precision potting system designed for applications requiring bubble-free encapsulation of electronic components. By performing the dispensing process inside a vacuum chamber, this machine eliminates trapped air and voids that can compromise the insulation and protection performance of potted assemblies.
The vacuum chamber achieves an ultimate vacuum of 200Pa (2mbar), ensuring that air is thoroughly removed from both the material and the component cavities before and during dispensing. The single-head working range of 400mm * 400mm * 100mm accommodates a wide variety of PCB sizes and component heights. Motion control is handled by a servo motor + ball screw drive, delivering smooth, precise positioning with motion speeds up to 500mm/s on X-Y axes and 200mm/s on Z-axis.
The fluid system handles materials with operational viscosity up to 100,000cP, making it suitable for a broad range of potting compounds including epoxies, silicones, and polyurethanes. Mixing ratio is adjustable from 100:100 to 100:20 or 100:20 to 100:10, providing flexibility for different two-part material systems. Dispensing accuracy of ±2% (based on 10g benchmark) ensures consistent material volume for each product. Glue dispensing speed can be selected between 1g/s~15g/s or 5g/s~30g/s depending on application requirements. Metering is accomplished via stepper motor + gear pump or screw pump for precise volumetric control.
The anti-curing function prevents material from hardening inside the mixing head during production pauses, while the fully automatic cleaning function simplifies changeover between different material types or at the end of production shifts. The system is controlled by an industrial PC with monitor and motion control card, with simple start switch operation for ease of use. The SMEMA interface enables seamless integration into automated SMT lines.
Technical Specifications
Parameter
Specification
Model
HP-VP450
Machine Dimensions
L2900*W1520*H2000mm
Weight
Approx. 1000KG
Control System
Industrial PC + Monitor + Motion Control Card
Operation Method
Start switch
Single-Head Working Range
400mm (X) * 400mm (Y) * 100mm (Z)
Motion Speed (X-Y)
0-500mm/s
Motion Speed (Z)
0-200mm/s
Drive Method
Servo motor + ball screw
Operational Viscosity
Up to 100,000cP
Dispensing Accuracy
±2% (based on 10g benchmark)
Mixing Ratio (Option 1)
100:100 to 100:20 adjustable
Mixing Ratio (Option 2)
100:20 to 100:10 adjustable
Glue Dispensing Speed (Option 1)
1g/s ~ 15g/s
Glue Dispensing Speed (Option 2)
5g/s ~ 30g/s
Metering Method
Stepper motor + gear pump / screw pump
Anti-Curing Function
Available
Cleaning Function
Fully automatic draining
Vacuum Chamber Ultimate Vacuum
200Pa (2mbar)
Power
AC220V 50Hz, 8.5KW
Interface
SMEMA
Working Environment
Temperature: 0-40°C, Humidity: 20-90%
Key Features
Vacuum Potting Environment: 200Pa (2mbar) ultimate vacuum eliminates bubbles and voids for perfect encapsulation
Precision Dispensing: ±2% dispensing accuracy (based on 10g benchmark) for consistent material volume
High Viscosity Capability: Handles materials up to 100,000cP operational viscosity
Flexible Mixing Ratio: Adjustable from 100:100 to 100:20 or 100:20 to 100:10 for two-part material systems
Dual Dispensing Speed Options: Choose 1g/s~15g/s or 5g/s~30g/s based on application needs
High-Precision Motion: Servo motor + ball screw drive with smooth, accurate positioning
Generous Working Range: 400*400*100mm single-head coverage for diverse PCB sizes
Anti-Curing Function: Prevents material hardening during production pauses
Automatic Cleaning: Fully automatic draining/cleaning function for easy changeover
Simple Operation: Start switch control with industrial PC + monitor interface
SMEMA Integration: Standard interface for automated line communication
Applications
Power electronics potting (IGBT modules, power supplies)