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Shenzhen Haipai Holding Co., Ltd

  • China,Shenzhen
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China HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue
China HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue

  1. China HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue
  2. China HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue

HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue

  1. MOQ: 1 unit
  2. Price:
  3. Get Latest Price
Ultra-High Speed 1000mm/s maximum movement for maximum throughput
Automatic Width Adjustment 50-400mm track width with SMEMA integration
Payment Terms T/T
Packaging Details Wooden case with vacuum package inside
Visual Programming Online programming from board images for simple, fast setup
Delivery Time 30 working days
Exceptional Precision ±0.01mm repeat accuracy with servo + grinding screw drive
Piezoelectric Jet Technology H-Y01 valve with customizable nozzle for precision non-contact dispensing
CCD Visual Positioning Automatic calibration and real-time error correction
Brand Name Haipai
Place of Origin China
Certification CE,ISO9001
Model Number HP-D30

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  1. Product Details
  2. Company Details

Product Specification

Ultra-High Speed 1000mm/s maximum movement for maximum throughput Automatic Width Adjustment 50-400mm track width with SMEMA integration
Payment Terms T/T Packaging Details Wooden case with vacuum package inside
Visual Programming Online programming from board images for simple, fast setup Delivery Time 30 working days
Exceptional Precision ±0.01mm repeat accuracy with servo + grinding screw drive Piezoelectric Jet Technology H-Y01 valve with customizable nozzle for precision non-contact dispensing
CCD Visual Positioning Automatic calibration and real-time error correction Brand Name Haipai
Place of Origin China Certification CE,ISO9001
Model Number HP-D30
High Light Piezoelectric Jet Dispensing MachineHigh Speed Jet Dispensing MachinePiezoelectric Glue Dispensing Machine
High-Speed Piezoelectric Jet Dispensing Machine
The HP-D30 sets a new benchmark in high-speed dispensing, combining piezoelectric jet technology with precision motion control to achieve an extraordinary 1000mm/s maximum movement speed while maintaining ±0.01mm repeat accuracy. Powered by the H-Y01 piezoelectric jet valve with customizable nozzle impact pin, this system delivers non-contact dispensing with precise droplet control—eliminating Z-axis movement between dots and dramatically increasing throughput for underfill, encapsulation, and precision adhesive applications.
Technical Specifications
Model HP-D30
Machine Dimensions L990*W1350*H1600mm
Weight 1000kg
Control Method Industrial PC + Motion Control Card
Programming Online visual programming
CCD Vision Automatic calibration and error correction
X/Y/Z Drive Servo motor + precision grinding screw
Max Movement Speed 1000mm/s
Repeat Accuracy ±0.01mm
Dispensing Itinerary X=400mm, Y=400mm, Z=50mm
Component Height 50mm max
Dispensing Valve 1x H-Y01 piezoelectric jet valve
Material Capacity 30CC / 50CC
Track Width 50-400mm (automatic adjust)
Conveyor Speed 0.5-3.5m/min adjustable
Air Pressure 6.2kgf/cm²
Power Supply 220V 50-60Hz
Total Power 3KW
Interface SMEMA
Alarm System Menu display + sound/light alarm
Applications
  • Underfill for flip chips and BGAs
  • Precision adhesive dispensing
  • Encapsulation and dam & fill
  • Solder paste jetting
  • Thermal interface material application
  • Camera module assembly
  • MEMS and sensor packaging
  • High-precision electronics assembly


Industry Keywords Tag Cloud :


Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System


Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application


Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric


Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection


Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control


Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter

  • Year Established:

    2014

  • Employee Number:

    280~300

  • Ecer Certification:

    Verified Supplier

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  • Shenzhen Haipai Holding Co., Ltd
  • No.1303, Building 2, Kechuang Workshop, No.6 Songjiang Road,  Shapu Community, Songgang Sub-district,‌Bao'an District, Shenzhen.
  • https://www.haipairobot.com/

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