Doorbell 5g Circuit Board Design Electronic Lock Camera Copper SMT Pcb Assembly

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Payment Terms	T/T
Supply Ability	10000unit per month
Delivery Time	10-14working days
Packaging Details	20units per package box size 201510cm
Base Material:	FR4/ROGERS/Aluminum/High TG
Board thickness	0.7mm
Min. Line Spacing:	0.06mm
Line width/space	50um/50um
Soldermask	Black
Laser size	75um
Brand Name	TOPCBS
Model Number	Mobile Phone motherboard
Certification	UL94V0
Place of Origin	Suzhou China

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Product Specification


Payment Terms	T/T	Supply Ability	10000unit per month
Delivery Time	10-14working days	Packaging Details	20units per package box size 201510cm
Base Material:	FR4/ROGERS/Aluminum/High TG	Board thickness	0.7mm
Min. Line Spacing:	0.06mm	Line width/space	50um/50um
Soldermask	Black	Laser size	75um
Brand Name	TOPCBS	Model Number	Mobile Phone motherboard
Certification	UL94V0	Place of Origin	Suzhou China
High Light	doorbell pcb 5g Circuit Boards ，pcb 5g Circuit Boards doorbell ，Doorbell 5g Circuit Boards Design

Electronic Lock HDI Pcb Board Doorbell PCB & Pcba Assembly Camera Copper SMT Assembly

Use little soldermask: most soldermasks have a high moisture absorption capacity. In case this happens, high losses can occur in the circuit;
Use perfectly smooth copper traces and plans: The current skin depth, in fact, is inversely proportional to the frequency and therefore, on a printed circuit board with high frequency signals, it is very shallow. An irregular copper surface will offer the current an irregular path, increasing the resistive losses;
Signal integrity: High frequencies represent one of the most difficult challenges for the integrated circuit designer. In order to maximize I/O, high density interconnections (HDI) require thinner tracks, a factor that can cause signal degradation leading to further losses. These losses adversely affect the transmission of the RF signal, which can be delayed for several milliseconds, in turn causing problems in the signal transmission chain. In high frequency domain, signal integrity is almost entirely based on checking impedance. Traditional PCB manufacturing processes, such as the subtractive process, have the disadvantage of creating tracks with a trapezoidal cross section (the angle, compared to the vertical perpendicular to the track, is normally between 25 and 45 degrees). These cross sections modify the impedance of the tracks themselves, placing serious limits on 5G applications. However, the problem can be solved by using the mSAP (Semi-Additive fabrication Process) technique, which allows to create traces with greater precision, allowing trace geometries to be defined via photolithography. In Figure 2 we can see a comparison of the two manufacturing processes.

1. Product application

Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.

2 . Specifications:

Name	10Layer anylayer HDI PCB for 5G mobile phone motherboard
Layer	10
Quality Grade	IPC 6012 Class 2,IPC 6012 Class 3
Material	EM370
Min Track/Spacing	75um/100um
Drilling Size	100um
Solder Mask	Green
Silkscreen	White
Surface Finish	Immersion gold
Finished Copper	1/3OZ
Production time	10-21 working days
Lead time	2-3 days

PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory



Business Type:

Manufacturer 


Year Established:

1999 


Total Annual:

400 million-600 million


Employee Number:

500~1000 


Ecer Certification：

Active Member 

Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.

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Reach Us
Topmatch Electronics (Suzhou) Co., Limited.
Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
https://www.hdi-pcbs.com/

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