Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20unit per package package size:20*15*10cm |
| Name | 10L Tablet computer mainboard |
| Drilling Size | 75um |
| Raw material | EM370 |
| Min. Line Width | 3mil |
| Board Thickness | 0.7mm |
| Stack up | 2-6-2 |
| Finish treatment | Immersion gold+OSP |
| Line width/space | 50um / 60um |
| Brand Name | TOPCBS |
| Model Number | 10L Tablet computer mainboard |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20unit per package package size:20*15*10cm |
| Name | 10L Tablet computer mainboard | Drilling Size | 75um |
| Raw material | EM370 | Min. Line Width | 3mil |
| Board Thickness | 0.7mm | Stack up | 2-6-2 |
| Finish treatment | Immersion gold+OSP | Line width/space | 50um / 60um |
| Brand Name | TOPCBS | Model Number | 10L Tablet computer mainboard |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | FR4 PCB Circuit Board ，EM370 PCB Circuit Board ，3mil Electronic Circuit Board | ||
Electronic Customer Fr4 Pcb Manufacturer PCB Circuit Board HDI PCB
HDI boards, one of the fastest growing technologies in PCBs, are now available at Epec. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
Specifications:
| Layers | 1-30layers |
| HDI | 1+N+1&2+N+2&3+N+3 |
| Material | FR4, CEM3, Rogers, High TG, High Frequency Board,Aluminum, Copper, Ceramic etc. |
| Finised inner/outer copper thickness | 0.5-6oz, regular 1oz |
| Finished board thickness | 0.2-7.0mm,regular 1.6mm |
| Min through holes size | 0.15mm |
| Max panel size | 800*1200mm |
| Min panel size | 5*5mm |
| Finger(Au) | 1-50U'', regular 30U'' |
| Soldermask color | White, Black, Green, Red, Blue, Yellow, etc |
| Silk Screen | White, Black, etc. |
| Silk Screen Min Line Width | 0.1mm |
| Min Trace/Gap | 3/3mil |
| Surface Finish | HASL, HASL lead free, ENIG, OSP, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold |
| Controlled Impedance | +/-5% |
| Plugging vias capability | 0.2-0.8mm |
| Outline profile | Routing/Punch/V-cut/Stamp Hole |
| Cutting | V-score |
| Certification | UL USA, UL Canada, ROHS, ISO13485, ISO9001, ISO14001, IATF 16949 |
Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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